A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is le...

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Bibliographic Details
Main Authors: Lingyao Sun, Zhenhua Guo, Xiuchen Zhao, Ying Liu, Kingning Tu, Yingxia Liu
Format: Article
Language:English
Published: MDPI AG 2022-05-01
Series:Micromachines
Subjects:
low-temperature soldering
3D IC
Bi aggregation
Sn-Bi solder
Online Access:https://www.mdpi.com/2072-666X/13/6/867

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