A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is le...
| Main Authors: | , , , , , |
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| 格式: | Article |
| 語言: | English |
| 出版: |
MDPI AG
2022-05-01
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| 叢編: | Micromachines |
| 主題: | |
| 在線閱讀: | https://www.mdpi.com/2072-666X/13/6/867 |