Optimization of fin layout in liquid-cooled microchannels for multi-core chips

Optimization of fin layout in liquid-cooled microchannels for multi-core chips

When the dense pin-fins array distributed uniformly is used to dissipate the non-uniform heat source, it is easy to generate excessive cooling at the non-hot spot, which leads to unnecessary heat dissipation loss. In this study, a three-dimensional model of a multi-core chip-microchannel heat sink i...

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Bibliographic Details
Main Authors: Jian Zhang, Wenyong Guo, Zhihui Xie, Xiaonan Guan, Xuejian Qu, Yanlin Ge
Format: Article
Language:English
Published: Elsevier 2023-01-01
Series:Case Studies in Thermal Engineering
Subjects:
Constructal theory
Fin layout
Multi-chip module
Microchannels
Thermal reliability
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X22008528

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