Measurement of Sub-Surface Microstructures Based on a Developed Ultrasonic Atomic Force Microscopy

Accurate and non-destructive technology for detection of subsurface defect has become a key requirement with the emergence of various ultra-precision machining technologies and the application of ultra-precision components. The combination of acoustic technique for sub-surface detection and atomic f...

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Bibliographic Details
Main Authors: Yuyang Wang, Chengjian Wu, Jinyan Tang, Mingyu Duan, Jian Chen, Bing-Feng Ju, Yuan-Liu Chen
Format: Article
Language:English
Published: MDPI AG 2022-05-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/12/11/5460
Description
Summary:Accurate and non-destructive technology for detection of subsurface defect has become a key requirement with the emergence of various ultra-precision machining technologies and the application of ultra-precision components. The combination of acoustic technique for sub-surface detection and atomic force microscopy (AFM) for measurement with high resolution is a potential method for studying the subsurface structure of workpiece. For this purpose, contact-resonance AFM (CR-AFM) is a typical technique. In this paper, a CR-AFM system with a different principle from commercially available instruments is set up and used for the detection of sub-surface Si samples with grating structures and covered by different thickness of highly oriented pyrolytic graphite (HOPG). The influence of subsurface burial depth on the detection capability is studied by simulations and experiments. The thickest HOPG film allowing for sub-surface measurement by the proposed method is verified to be about 30 μm, which is much larger than the feature size of the subsurface microstructure. The manuscript introduces the difference between this subsurface topography measurement principle and the commercially available AFM measurement principle, and analyzes its advantages and disadvantages. The experimental results demonstrates that the technique has the capability to reveal sub-surface microstructures with relatively large buried depth and is potential for engineering application in ultra-precision technologies.
ISSN:2076-3417