Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer
Diamond-incorporated copper metal matrix layers were fabricated on brass substrates by using electrodeposition technology in this study. To improve the adhesion of the composite coatings on the brass substrate, a plated copper was applied as the interlayer between the multilayers and the substrate....
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-05-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/14/10/2571 |