Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board
Reduction melting methods to remove Pb from lead silicate glasses such as cathode ray tube funnel glass have been extensively studied. In this paper, reduction melting of a model lead glass was conducted using printed circuit board as reductant. Model lead silicate glass, viscosity reducing agent (N...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
The Mining and Materials Processing Institute of Japan
2020-04-01
|
| Series: | Journal of MMIJ |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/journalofmmij/136/4/136_25/_pdf/-char/en |
| _version_ | 1827868304485646336 |
|---|---|
| author | Hiroyuki INANO Keiichi TOMITA Tatsumi TADA Naoki HIROYOSHI |
| author_facet | Hiroyuki INANO Keiichi TOMITA Tatsumi TADA Naoki HIROYOSHI |
| author_sort | Hiroyuki INANO |
| collection | DOAJ |
| description | Reduction melting methods to remove Pb from lead silicate glasses such as cathode ray tube funnel glass have been extensively studied. In this paper, reduction melting of a model lead glass was conducted using printed circuit board as reductant. Model lead silicate glass, viscosity reducing agent (Na2CO3), and printed circuit board were mixed and melted at 1473 K. Metal phase mainly composed of Pb was formed and settled in the melting glass residue. With increasing printed circuit board addition, the amount of metal phase increased and the concentrations of PbO remained in the glass residue decreased, indicating that addition of printed circuit board is effective to remove Pb from the Pb glass. By EDS analysis, it was confirmed that Cu, Ni and Sn are contained in the metal phase, indicating that metals in printed circuit board are recovered with Pb. |
| first_indexed | 2024-03-12T15:28:47Z |
| format | Article |
| id | doaj.art-a746d74423e040d9be7739bc0726e248 |
| institution | Directory Open Access Journal |
| issn | 1881-6118 1884-0450 |
| language | English |
| last_indexed | 2024-03-12T15:28:47Z |
| publishDate | 2020-04-01 |
| publisher | The Mining and Materials Processing Institute of Japan |
| record_format | Article |
| series | Journal of MMIJ |
| spelling | doaj.art-a746d74423e040d9be7739bc0726e2482023-08-10T09:28:19ZengThe Mining and Materials Processing Institute of JapanJournal of MMIJ1881-61181884-04502020-04-011364253210.2473/journalofmmij.136.25journalofmmijMetal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit BoardHiroyuki INANO0Keiichi TOMITA1Tatsumi TADA2Naoki HIROYOSHI3Industrial Research Institute, Hokkaido Research OrganizationIndustrial Research Institute, Hokkaido Research OrganizationIndustrial Research Institute, Hokkaido Research OrganizationProfessor, Graduate School of Engineering, Hokkaido UniversityReduction melting methods to remove Pb from lead silicate glasses such as cathode ray tube funnel glass have been extensively studied. In this paper, reduction melting of a model lead glass was conducted using printed circuit board as reductant. Model lead silicate glass, viscosity reducing agent (Na2CO3), and printed circuit board were mixed and melted at 1473 K. Metal phase mainly composed of Pb was formed and settled in the melting glass residue. With increasing printed circuit board addition, the amount of metal phase increased and the concentrations of PbO remained in the glass residue decreased, indicating that addition of printed circuit board is effective to remove Pb from the Pb glass. By EDS analysis, it was confirmed that Cu, Ni and Sn are contained in the metal phase, indicating that metals in printed circuit board are recovered with Pb.https://www.jstage.jst.go.jp/article/journalofmmij/136/4/136_25/_pdf/-char/encathode ray tube glassprinted circuit boardslead oxidereduction meltinglead bromide |
| spellingShingle | Hiroyuki INANO Keiichi TOMITA Tatsumi TADA Naoki HIROYOSHI Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board Journal of MMIJ cathode ray tube glass printed circuit boards lead oxide reduction melting lead bromide |
| title | Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board |
| title_full | Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board |
| title_fullStr | Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board |
| title_full_unstemmed | Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board |
| title_short | Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board |
| title_sort | metal recovery and pb removal by melting mixture of lead glass and printed circuit board |
| topic | cathode ray tube glass printed circuit boards lead oxide reduction melting lead bromide |
| url | https://www.jstage.jst.go.jp/article/journalofmmij/136/4/136_25/_pdf/-char/en |
| work_keys_str_mv | AT hiroyukiinano metalrecoveryandpbremovalbymeltingmixtureofleadglassandprintedcircuitboard AT keiichitomita metalrecoveryandpbremovalbymeltingmixtureofleadglassandprintedcircuitboard AT tatsumitada metalrecoveryandpbremovalbymeltingmixtureofleadglassandprintedcircuitboard AT naokihiroyoshi metalrecoveryandpbremovalbymeltingmixtureofleadglassandprintedcircuitboard |