Modulators in Silicon Photonics—Heterogenous Integration & and Beyond
The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2022-01-01
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Series: | Photonics |
Subjects: | |
Online Access: | https://www.mdpi.com/2304-6732/9/1/40 |
Summary: | The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III–V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated. |
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ISSN: | 2304-6732 |