Heat conductive h-BN/CTPB/epoxy with enhanced dielectric properties for potential high-voltage applications
To enhance the toughness and electrical insulation properties of cured epoxy, carboxyl-terminated polybutadiene (CTPB) liquid rubber was used to modify epoxy in this study, and the thermal conductivity, mechanical and dielectric properties of modified epoxy were investigated. The results indicate th...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2017-06-01
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| Series: | High Voltage |
| Subjects: | |
| Online Access: | https://digital-library.theiet.org/content/journals/10.1049/hve.2017.0053 |
| _version_ | 1819180378878902272 |
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| author | Ying Gong Wenying Zhou Yujia Kou Li Xu Hongju Wu Wei Zhao |
| author_facet | Ying Gong Wenying Zhou Yujia Kou Li Xu Hongju Wu Wei Zhao |
| author_sort | Ying Gong |
| collection | DOAJ |
| description | To enhance the toughness and electrical insulation properties of cured epoxy, carboxyl-terminated polybutadiene (CTPB) liquid rubber was used to modify epoxy in this study, and the thermal conductivity, mechanical and dielectric properties of modified epoxy were investigated. The results indicate that the CTPB-epoxy exhibits higher impact strength and lower dielectric constant and loss compared with pure epoxy. Further, hexagonal boron nitride (hBN) was used to reinforce epoxy modified with 20 phr CTPB. It is found that compared with the hBN/epoxy under the same filler loading, the heat conductive hBN/CTPB/epoxy possesses a lower dielectric permittivity and dissipation factor in all frequency ranging from 10^2–10^7 Hz, a higher electrical resistivity and dielectric breakdown strength, and improved mechanical toughness. Therefore, the prepared hBN/CTPB/epoxy composites are potentially useful in practical electrical insulation applications. |
| first_indexed | 2024-12-22T22:13:24Z |
| format | Article |
| id | doaj.art-a8545b4723cb4b32882418b61956de34 |
| institution | Directory Open Access Journal |
| issn | 2397-7264 |
| language | English |
| last_indexed | 2024-12-22T22:13:24Z |
| publishDate | 2017-06-01 |
| publisher | Wiley |
| record_format | Article |
| series | High Voltage |
| spelling | doaj.art-a8545b4723cb4b32882418b61956de342022-12-21T18:10:50ZengWileyHigh Voltage2397-72642017-06-0110.1049/hve.2017.0053HVE.2017.0053Heat conductive h-BN/CTPB/epoxy with enhanced dielectric properties for potential high-voltage applicationsYing Gong0Wenying Zhou1Yujia Kou2Li Xu3Hongju Wu4Wei Zhao5Xi'an University of Science and TechnologyXi'an University of Science and TechnologyXi'an University of Science and TechnologyXi'an University of Science and TechnologyXi'an University of Science and TechnologyXi'an University of Science and TechnologyTo enhance the toughness and electrical insulation properties of cured epoxy, carboxyl-terminated polybutadiene (CTPB) liquid rubber was used to modify epoxy in this study, and the thermal conductivity, mechanical and dielectric properties of modified epoxy were investigated. The results indicate that the CTPB-epoxy exhibits higher impact strength and lower dielectric constant and loss compared with pure epoxy. Further, hexagonal boron nitride (hBN) was used to reinforce epoxy modified with 20 phr CTPB. It is found that compared with the hBN/epoxy under the same filler loading, the heat conductive hBN/CTPB/epoxy possesses a lower dielectric permittivity and dissipation factor in all frequency ranging from 10^2–10^7 Hz, a higher electrical resistivity and dielectric breakdown strength, and improved mechanical toughness. Therefore, the prepared hBN/CTPB/epoxy composites are potentially useful in practical electrical insulation applications.https://digital-library.theiet.org/content/journals/10.1049/hve.2017.0053heat conductiondielectric propertiesepoxy insulationrubberpermittivityelectric breakdownheat conductive epoxyenhanced dielectric propertiescured epoxycarboxyl-terminated polybutadieneCTPB liquid rubberthermal conductivityhexagonal boron nitridedielectric permittivitydissipation factorelectrical resistivitydielectric breakdown strengthmechanical toughnesselectrical insulation |
| spellingShingle | Ying Gong Wenying Zhou Yujia Kou Li Xu Hongju Wu Wei Zhao Heat conductive h-BN/CTPB/epoxy with enhanced dielectric properties for potential high-voltage applications High Voltage heat conduction dielectric properties epoxy insulation rubber permittivity electric breakdown heat conductive epoxy enhanced dielectric properties cured epoxy carboxyl-terminated polybutadiene CTPB liquid rubber thermal conductivity hexagonal boron nitride dielectric permittivity dissipation factor electrical resistivity dielectric breakdown strength mechanical toughness electrical insulation |
| title | Heat conductive h-BN/CTPB/epoxy with enhanced dielectric properties for potential high-voltage applications |
| title_full | Heat conductive h-BN/CTPB/epoxy with enhanced dielectric properties for potential high-voltage applications |
| title_fullStr | Heat conductive h-BN/CTPB/epoxy with enhanced dielectric properties for potential high-voltage applications |
| title_full_unstemmed | Heat conductive h-BN/CTPB/epoxy with enhanced dielectric properties for potential high-voltage applications |
| title_short | Heat conductive h-BN/CTPB/epoxy with enhanced dielectric properties for potential high-voltage applications |
| title_sort | heat conductive h bn ctpb epoxy with enhanced dielectric properties for potential high voltage applications |
| topic | heat conduction dielectric properties epoxy insulation rubber permittivity electric breakdown heat conductive epoxy enhanced dielectric properties cured epoxy carboxyl-terminated polybutadiene CTPB liquid rubber thermal conductivity hexagonal boron nitride dielectric permittivity dissipation factor electrical resistivity dielectric breakdown strength mechanical toughness electrical insulation |
| url | https://digital-library.theiet.org/content/journals/10.1049/hve.2017.0053 |
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