Ti/Cu/Kovar Multilayer Interlayer PTLP Diffusion Bonding Si<sub>3</sub>N<sub>4</sub>/Ht250

Ti/Cu/Kovar Multilayer Interlayer PTLP Diffusion Bonding Si<sub>3</sub>N<sub>4</sub>/Ht250

In this paper, partial transient liquid phase (PTLP) diffusion bonding between Si<sub>3</sub>N<sub>4</sub> ceramics and Ht250 cast iron was carried out by using an Ti/Cu/Kovar/Cu/Ti interlayer. The effects of the heating temperature and holding time on the microstructure, for...

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Bibliographic Details
Main Authors:	Deku Zhang, Lian Zhang, Ning Zhou, Kehong Wang, Xiaopeng Li
Format:	Article
Language:	English
Published:	MDPI AG 2022-07-01
Series:	Ceramics
Subjects:	Si<sub>3</sub>N<sub>4</sub> Ht250 Ti/Cu/Kovar/Cu/Ti PTLP shear strength
Online Access:	https://www.mdpi.com/2571-6131/5/3/29

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