Effect of thermoelastic damping on silicon, GaAs, diamond and SiC micromechanical resonators
The effect of thermoelastic damping as a main dissipation mechanism in single crystalline silicon, GaAs, diamond, SiC and SiO2 micromechanical resonators are studied. Numerical simulation is performed to compare quality factors of the given materials. Results using Zener’s well-known approximation a...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2017-05-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.4984288 |