Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites
The three-dimensional (3D) printing of a SiO<sub>2</sub>-filled thermosetting polyimide (SiO<sub>2</sub>@TSPI) composite with outstanding performance is realized via the direct ink writing (DIW) of polyamide acid (PAA) composite ink and thermal treatment conducted thereafter....
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-06-01
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| Series: | Polymers |
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| Online Access: | https://www.mdpi.com/2073-4360/14/13/2669 |
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| author | Keda Li Jinghong Ding Yuxiong Guo Hongchao Wu Wenwen Wang Jiaqi Ji Qi Pei Chenliang Gong Zhongying Ji Xiaolong Wang |
| author_facet | Keda Li Jinghong Ding Yuxiong Guo Hongchao Wu Wenwen Wang Jiaqi Ji Qi Pei Chenliang Gong Zhongying Ji Xiaolong Wang |
| author_sort | Keda Li |
| collection | DOAJ |
| description | The three-dimensional (3D) printing of a SiO<sub>2</sub>-filled thermosetting polyimide (SiO<sub>2</sub>@TSPI) composite with outstanding performance is realized via the direct ink writing (DIW) of polyamide acid (PAA) composite ink and thermal treatment conducted thereafter. The composite ink consists of phenylethynyl-terminated PAA and silica nanoparticles, where the SiO<sub>2</sub> nanoparticles serve as the rheology modifier that is necessary for the DIW technique to obtain self-supporting feedstock during 3D printing and the reinforcement filler that is used to enhance the performance of the final composite. As a result, printed parts with complex geometry and robust thermal stability are obtained. Due to the extrusion-based DIW technique, the printed structures exhibit anisotropic mechanical strength that highly depends on printing roads. This simple and convenient means of realizing 3D structures of thermosetting polyimides is a promising strategy in aerospace and other fields. |
| first_indexed | 2024-03-09T10:26:05Z |
| format | Article |
| id | doaj.art-aac973296f2d485fb0600f57a13fdd02 |
| institution | Directory Open Access Journal |
| issn | 2073-4360 |
| language | English |
| last_indexed | 2024-03-09T10:26:05Z |
| publishDate | 2022-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Polymers |
| spelling | doaj.art-aac973296f2d485fb0600f57a13fdd022023-12-01T21:39:41ZengMDPI AGPolymers2073-43602022-06-011413266910.3390/polym14132669Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide CompositesKeda Li0Jinghong Ding1Yuxiong Guo2Hongchao Wu3Wenwen Wang4Jiaqi Ji5Qi Pei6Chenliang Gong7Zhongying Ji8Xiaolong Wang9State Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, ChinaState Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, ChinaState Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, ChinaState Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, ChinaState Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, ChinaState Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, ChinaState Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, ChinaState Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, ChinaState Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, ChinaState Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, ChinaThe three-dimensional (3D) printing of a SiO<sub>2</sub>-filled thermosetting polyimide (SiO<sub>2</sub>@TSPI) composite with outstanding performance is realized via the direct ink writing (DIW) of polyamide acid (PAA) composite ink and thermal treatment conducted thereafter. The composite ink consists of phenylethynyl-terminated PAA and silica nanoparticles, where the SiO<sub>2</sub> nanoparticles serve as the rheology modifier that is necessary for the DIW technique to obtain self-supporting feedstock during 3D printing and the reinforcement filler that is used to enhance the performance of the final composite. As a result, printed parts with complex geometry and robust thermal stability are obtained. Due to the extrusion-based DIW technique, the printed structures exhibit anisotropic mechanical strength that highly depends on printing roads. This simple and convenient means of realizing 3D structures of thermosetting polyimides is a promising strategy in aerospace and other fields.https://www.mdpi.com/2073-4360/14/13/2669direct ink writingthermosetting polyimidedimensional shrinkagethermal stability |
| spellingShingle | Keda Li Jinghong Ding Yuxiong Guo Hongchao Wu Wenwen Wang Jiaqi Ji Qi Pei Chenliang Gong Zhongying Ji Xiaolong Wang Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites Polymers direct ink writing thermosetting polyimide dimensional shrinkage thermal stability |
| title | Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites |
| title_full | Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites |
| title_fullStr | Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites |
| title_full_unstemmed | Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites |
| title_short | Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites |
| title_sort | direct ink writing of phenylethynyl end capped oligoimide sio sub 2 sub to additively manufacture high performance thermosetting polyimide composites |
| topic | direct ink writing thermosetting polyimide dimensional shrinkage thermal stability |
| url | https://www.mdpi.com/2073-4360/14/13/2669 |
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