Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites

Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO<sub>2</sub> to Additively Manufacture High-Performance Thermosetting Polyimide Composites

The three-dimensional (3D) printing of a SiO<sub>2</sub>-filled thermosetting polyimide (SiO<sub>2</sub>@TSPI) composite with outstanding performance is realized via the direct ink writing (DIW) of polyamide acid (PAA) composite ink and thermal treatment conducted thereafter....

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Bibliographic Details
Main Authors: Keda Li, Jinghong Ding, Yuxiong Guo, Hongchao Wu, Wenwen Wang, Jiaqi Ji, Qi Pei, Chenliang Gong, Zhongying Ji, Xiaolong Wang
Format: Article
Language:English
Published: MDPI AG 2022-06-01
Series:Polymers
Subjects:
direct ink writing
thermosetting polyimide
dimensional shrinkage
thermal stability
Online Access:https://www.mdpi.com/2073-4360/14/13/2669

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