Optimization of Copper Thermocompression Diffusion Bonding under Vacuum: Microstructural and Mechanical Characteristics

Optimization of Copper Thermocompression Diffusion Bonding under Vacuum: Microstructural and Mechanical Characteristics

The optimization of the autogenous diffusion copper bonding via thermocompression at vacuum environment was investigated. The influence of various bonding parameters on the interdiffusion efficiency was studied in detail at the micro (SEM-EBSD) and nano (TEM) scales. Bonding at 1000 °C for...

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Bibliographic Details
Main Authors: Michail Samouhos, Antonis Peppas, Panagiotis Angelopoulos, Maria Taxiarchou, Petros Tsakiridis
Format: Article
Language:English
Published: MDPI AG 2019-09-01
Series:Metals
Subjects:
copper
thermocompression
bonding
diffusion
microstructure characterization
Online Access:https://www.mdpi.com/2075-4701/9/10/1044

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