CuS/rGO-PEG Nanocomposites for Photothermal Bonding of PMMA-Based Plastic Lab-on-a-Chip
We developed copper sulfide (CuS)/reduced graphene oxide (rGO)-poly (ethylene glycol) (PEG) nanocomposites for photothermal bonding of a polymethyl methacrylate (PMMA)-based plastic lab-on-a-chip. The noncontact photothermal bonding of PMMA-based plastic labs-on-chip plays an important role in impro...
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| Format: | Article |
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MDPI AG
2021-01-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/11/1/176 |
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| author | Young Jae Kim Jae Hyun Lim Jong Min Lee Ji Wook Choi Hyung Woo Choi Won Ho Seo Kyoung G. Lee Seok Jae Lee Bong Geun Chung |
| author_facet | Young Jae Kim Jae Hyun Lim Jong Min Lee Ji Wook Choi Hyung Woo Choi Won Ho Seo Kyoung G. Lee Seok Jae Lee Bong Geun Chung |
| author_sort | Young Jae Kim |
| collection | DOAJ |
| description | We developed copper sulfide (CuS)/reduced graphene oxide (rGO)-poly (ethylene glycol) (PEG) nanocomposites for photothermal bonding of a polymethyl methacrylate (PMMA)-based plastic lab-on-a-chip. The noncontact photothermal bonding of PMMA-based plastic labs-on-chip plays an important role in improving the stability and adhesion at a high-temperature as well as minimizing the solution leakage from microchannels when connecting two microfluidic devices. The CuS/rGO-PEG nanocomposites were used to bond a PMMA-based plastic lab-on-a-chip in a short time with a high photothermal effect by a near-infrared (NIR) laser irradiation. After the thermal bonding process, a gap was not generated in the PMMA-based plastic lab-on-a-chip due to the low viscosity and density of the CuS/rGO-PEG nanocomposites. We also evaluated the physical and mechanical properties after the thermal bonding process, showing that there was no solution leakage in PMMA-based plastic lab-on-a-chip during polymerase chain reaction (PCR) thermal cycles. Therefore, the CuS/rGO-PEG nanocomposite could be a potentially useful nanomaterial for non-contact photothermal bonding between the interfaces of plastic module lab-on-a-chip. |
| first_indexed | 2024-03-09T05:02:19Z |
| format | Article |
| id | doaj.art-aaf08f8888dd4d479c055b1431c0aa32 |
| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-09T05:02:19Z |
| publishDate | 2021-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj.art-aaf08f8888dd4d479c055b1431c0aa322023-12-03T12:59:09ZengMDPI AGNanomaterials2079-49912021-01-0111117610.3390/nano11010176CuS/rGO-PEG Nanocomposites for Photothermal Bonding of PMMA-Based Plastic Lab-on-a-ChipYoung Jae Kim0Jae Hyun Lim1Jong Min Lee2Ji Wook Choi3Hyung Woo Choi4Won Ho Seo5Kyoung G. Lee6Seok Jae Lee7Bong Geun Chung8Department of Mechanical Engineering, Sogang University, Seoul 04107, KoreaDepartment of Biomedical Engineering, Sogang University, Seoul 04107, KoreaDivision of Chemical Industry, Yeungnam University College, Daegu 38541, KoreaDepartment of Mechanical Engineering, Sogang University, Seoul 04107, KoreaDepartment of Mechanical Engineering, Sogang University, Seoul 04107, KoreaDepartment of Biomedical Engineering, Sogang University, Seoul 04107, KoreaDivision of Nano-Bio Sensors/Chips Development, National NanoFab Center, Daejeon 34141, KoreaDivision of Nano-Bio Sensors/Chips Development, National NanoFab Center, Daejeon 34141, KoreaDepartment of Mechanical Engineering, Sogang University, Seoul 04107, KoreaWe developed copper sulfide (CuS)/reduced graphene oxide (rGO)-poly (ethylene glycol) (PEG) nanocomposites for photothermal bonding of a polymethyl methacrylate (PMMA)-based plastic lab-on-a-chip. The noncontact photothermal bonding of PMMA-based plastic labs-on-chip plays an important role in improving the stability and adhesion at a high-temperature as well as minimizing the solution leakage from microchannels when connecting two microfluidic devices. The CuS/rGO-PEG nanocomposites were used to bond a PMMA-based plastic lab-on-a-chip in a short time with a high photothermal effect by a near-infrared (NIR) laser irradiation. After the thermal bonding process, a gap was not generated in the PMMA-based plastic lab-on-a-chip due to the low viscosity and density of the CuS/rGO-PEG nanocomposites. We also evaluated the physical and mechanical properties after the thermal bonding process, showing that there was no solution leakage in PMMA-based plastic lab-on-a-chip during polymerase chain reaction (PCR) thermal cycles. Therefore, the CuS/rGO-PEG nanocomposite could be a potentially useful nanomaterial for non-contact photothermal bonding between the interfaces of plastic module lab-on-a-chip.https://www.mdpi.com/2079-4991/11/1/176photothermal bondingPMMA-based plastic lab-on-a-chipCuS/rGO-PEG nanocomposite |
| spellingShingle | Young Jae Kim Jae Hyun Lim Jong Min Lee Ji Wook Choi Hyung Woo Choi Won Ho Seo Kyoung G. Lee Seok Jae Lee Bong Geun Chung CuS/rGO-PEG Nanocomposites for Photothermal Bonding of PMMA-Based Plastic Lab-on-a-Chip Nanomaterials photothermal bonding PMMA-based plastic lab-on-a-chip CuS/rGO-PEG nanocomposite |
| title | CuS/rGO-PEG Nanocomposites for Photothermal Bonding of PMMA-Based Plastic Lab-on-a-Chip |
| title_full | CuS/rGO-PEG Nanocomposites for Photothermal Bonding of PMMA-Based Plastic Lab-on-a-Chip |
| title_fullStr | CuS/rGO-PEG Nanocomposites for Photothermal Bonding of PMMA-Based Plastic Lab-on-a-Chip |
| title_full_unstemmed | CuS/rGO-PEG Nanocomposites for Photothermal Bonding of PMMA-Based Plastic Lab-on-a-Chip |
| title_short | CuS/rGO-PEG Nanocomposites for Photothermal Bonding of PMMA-Based Plastic Lab-on-a-Chip |
| title_sort | cus rgo peg nanocomposites for photothermal bonding of pmma based plastic lab on a chip |
| topic | photothermal bonding PMMA-based plastic lab-on-a-chip CuS/rGO-PEG nanocomposite |
| url | https://www.mdpi.com/2079-4991/11/1/176 |
| work_keys_str_mv | AT youngjaekim cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip AT jaehyunlim cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip AT jongminlee cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip AT jiwookchoi cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip AT hyungwoochoi cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip AT wonhoseo cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip AT kyoungglee cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip AT seokjaelee cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip AT bonggeunchung cusrgopegnanocompositesforphotothermalbondingofpmmabasedplasticlabonachip |