ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY
3-D finite element models of SOP( Small Outline Package) were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experim...
Main Authors: | REN Chao, SHAO Jiang, ZENG ChenHui, XUE HePing |
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Format: | Article |
Language: | zho |
Published: |
Editorial Office of Journal of Mechanical Strength
2016-01-01
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Series: | Jixie qiangdu |
Subjects: | |
Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2016.03.030 |
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