Application of Convolutional Neural Network to Predict Anisotropic Effective Thermal Conductivity of Semiconductor Package

Application of Convolutional Neural Network to Predict Anisotropic Effective Thermal Conductivity of Semiconductor Package

With increasing complexity of design patterns in semiconductor package substrates caused by demand for high-power semiconductors, it is necessary to be able to predict the thermal properties according to the pattern. Classifying the patterns is important to predict the effective thermal conductivity...

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Bibliographic Details
Main Authors: Tae-Hyun Kim, Jeong-Hyeon Park, Ki Wook Jung, Jaechoon Kim, Eun-Ho Lee
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Access
Subjects:
Artificial intelligence
convolutional neural network
effective thermal conductivity
finite element method
semiconductor package
Online Access:https://ieeexplore.ieee.org/document/9774413/

Internet

https://ieeexplore.ieee.org/document/9774413/

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