Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials
Micro-drilling transparent dielectric materials by using non-diffracting beams impinging orthogonally to the sample can be performed without scanning the beam position along the sample thickness. In this work, the laser micromachining process, based on the combination of picosecond pulsed Bessel bea...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2021-04-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/12/4/455 |
| _version_ | 1797537274324320256 |
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| author | Valeria V. Belloni Monica Bollani Shane M. Eaton Paolo Di Trapani Ottavia Jedrkiewicz |
| author_facet | Valeria V. Belloni Monica Bollani Shane M. Eaton Paolo Di Trapani Ottavia Jedrkiewicz |
| author_sort | Valeria V. Belloni |
| collection | DOAJ |
| description | Micro-drilling transparent dielectric materials by using non-diffracting beams impinging orthogonally to the sample can be performed without scanning the beam position along the sample thickness. In this work, the laser micromachining process, based on the combination of picosecond pulsed Bessel beams with the trepanning technique, is applied to different transparent materials. We show the possibility to create through-apertures with diameter on the order of tens of micrometers, on dielectric samples with different thermal and mechanical characteristics as well as different thicknesses ranging from two hundred to five hundred micrometers. Advantages and drawbacks of the application of this technique to different materials such as glass, polymer, or diamond are highlighted by analyzing the features, the morphology, and the aspect-ratio of the through-holes generated. Alternative Bessel beam drilling configurations, and the possibility of optimization of the quality of the aperture at the output sample/air interface is also discussed in the case of glass. |
| first_indexed | 2024-03-10T12:12:48Z |
| format | Article |
| id | doaj.art-adcb36cd6cac469cac3b81a069daa27f |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T12:12:48Z |
| publishDate | 2021-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-adcb36cd6cac469cac3b81a069daa27f2023-11-21T16:04:53ZengMDPI AGMicromachines2072-666X2021-04-0112445510.3390/mi12040455Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent MaterialsValeria V. Belloni0Monica Bollani1Shane M. Eaton2Paolo Di Trapani3Ottavia Jedrkiewicz4Dipartimento di Scienza e Alta Tecnologia, Università degli Studi dell’Insubria, Via Valleggio 11, 22100 Como, ItalyIstituto di Fotonica e Nanotecnologie (IFN)—CNR, L-NESS, Via Anzani 42, 22100 Como, ItalyIstituto di Fotonica e Nanotecnologie (IFN)—CNR, Piazza Leonardo da Vinci 32, 20133 Milano, ItalyDipartimento di Scienza e Alta Tecnologia, Università degli Studi dell’Insubria, Via Valleggio 11, 22100 Como, ItalyIstituto di Fotonica e Nanotecnologie (IFN)—CNR, Udr di Como, Via Valleggio 11, 22100 Como, ItalyMicro-drilling transparent dielectric materials by using non-diffracting beams impinging orthogonally to the sample can be performed without scanning the beam position along the sample thickness. In this work, the laser micromachining process, based on the combination of picosecond pulsed Bessel beams with the trepanning technique, is applied to different transparent materials. We show the possibility to create through-apertures with diameter on the order of tens of micrometers, on dielectric samples with different thermal and mechanical characteristics as well as different thicknesses ranging from two hundred to five hundred micrometers. Advantages and drawbacks of the application of this technique to different materials such as glass, polymer, or diamond are highlighted by analyzing the features, the morphology, and the aspect-ratio of the through-holes generated. Alternative Bessel beam drilling configurations, and the possibility of optimization of the quality of the aperture at the output sample/air interface is also discussed in the case of glass.https://www.mdpi.com/2072-666X/12/4/455laser fabricationmicro-hole drillingpulsed Bessel beamstransparent materials |
| spellingShingle | Valeria V. Belloni Monica Bollani Shane M. Eaton Paolo Di Trapani Ottavia Jedrkiewicz Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials Micromachines laser fabrication micro-hole drilling pulsed Bessel beams transparent materials |
| title | Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials |
| title_full | Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials |
| title_fullStr | Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials |
| title_full_unstemmed | Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials |
| title_short | Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials |
| title_sort | micro hole generation by high energy pulsed bessel beams in different transparent materials |
| topic | laser fabrication micro-hole drilling pulsed Bessel beams transparent materials |
| url | https://www.mdpi.com/2072-666X/12/4/455 |
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