INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITY
Background. Printed circuit boards of modern analog, digital and digital-analog electronic devices of medium complexity and higher have a base in the form of a stack-a set of layers for various purposes, which are subsequently pressed into a single printed circuit board. The materials used for the...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penza State University Publishing House
2021-11-01
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| Series: | Измерение, мониторинг, управление, контроль |
| Subjects: |
| _version_ | 1818401196551962624 |
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| author | P.A. Maksimov A.S. Ishkov M.K. Markelov |
| author_facet | P.A. Maksimov A.S. Ishkov M.K. Markelov |
| author_sort | P.A. Maksimov |
| collection | DOAJ |
| description | Background. Printed circuit boards of modern analog, digital and digital-analog electronic devices of medium
complexity and higher have a base in the form of a stack-a set of layers for various purposes, which are subsequently
pressed into a single printed circuit board. The materials used for the formation of these layers play a significant role
in the further performance of the electronic device, since they have different electrical, thermal and mechanical parameters
that determine the advantages of a particular stack and, accordingly, the possible limitations of the device made on
its basis. Materials and methods. The quality of the materials used for printed circuit boards is characterized by a variety
of technical parameters that can significantly affect the characteristics of the final electronic devices. The negative impact
of the materials of the printed circuit board stack can manifest itself both immediately after the manufacture of the
product, and during operation, leading to instantaneous or delayed failures of various types of criticality. Results. It is established
that in the conditions of production of modern electronic devices and printed circuit boards for them, including
those operating in high-frequency bands, the quality of their work can be influenced by a variety of factors. The paper
shows that in order to minimize the possible risks associated with various physical phenomena and the resulting
parasitic parameters of printed circuit board materials, it is necessary to conduct a simulation of its operation, taking into
account the possible parameters of the materials used and their impact on at least the most critical areas – the printed
circuit board, the installation sites of microcircuits and other radio elements. The values of the amount of heat released
per unit of its area are determined, since many characteristics of electronic components and printed circuit board materials,
their performance depends on the temperature regime within which they operate. Conclusions. The performed
studies allow us to exclude possible consequences of an increase in temperature in the device, for example, a change in
the shape of the transmitted signals, degradation of materials, thermal expansion of the board elements and, as a result,
rupture or damage to the copper tracks at the junction-the outer layer-the transition hole. |
| first_indexed | 2024-12-14T07:48:38Z |
| format | Article |
| id | doaj.art-ae251a803ffd4bb8a0662eea986eb879 |
| institution | Directory Open Access Journal |
| issn | 2307-5538 |
| language | English |
| last_indexed | 2024-12-14T07:48:38Z |
| publishDate | 2021-11-01 |
| publisher | Penza State University Publishing House |
| record_format | Article |
| series | Измерение, мониторинг, управление, контроль |
| spelling | doaj.art-ae251a803ffd4bb8a0662eea986eb8792022-12-21T23:10:48ZengPenza State University Publishing HouseИзмерение, мониторинг, управление, контроль2307-55382021-11-01310.21685/2307-5538-2021-3-7INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITYP.A. Maksimov0A.S. Ishkov1M.K. Markelov2Penza Research Electrotechnical InstitutePenza State UniversityPenza State UniversityBackground. Printed circuit boards of modern analog, digital and digital-analog electronic devices of medium complexity and higher have a base in the form of a stack-a set of layers for various purposes, which are subsequently pressed into a single printed circuit board. The materials used for the formation of these layers play a significant role in the further performance of the electronic device, since they have different electrical, thermal and mechanical parameters that determine the advantages of a particular stack and, accordingly, the possible limitations of the device made on its basis. Materials and methods. The quality of the materials used for printed circuit boards is characterized by a variety of technical parameters that can significantly affect the characteristics of the final electronic devices. The negative impact of the materials of the printed circuit board stack can manifest itself both immediately after the manufacture of the product, and during operation, leading to instantaneous or delayed failures of various types of criticality. Results. It is established that in the conditions of production of modern electronic devices and printed circuit boards for them, including those operating in high-frequency bands, the quality of their work can be influenced by a variety of factors. The paper shows that in order to minimize the possible risks associated with various physical phenomena and the resulting parasitic parameters of printed circuit board materials, it is necessary to conduct a simulation of its operation, taking into account the possible parameters of the materials used and their impact on at least the most critical areas – the printed circuit board, the installation sites of microcircuits and other radio elements. The values of the amount of heat released per unit of its area are determined, since many characteristics of electronic components and printed circuit board materials, their performance depends on the temperature regime within which they operate. Conclusions. The performed studies allow us to exclude possible consequences of an increase in temperature in the device, for example, a change in the shape of the transmitted signals, degradation of materials, thermal expansion of the board elements and, as a result, rupture or damage to the copper tracks at the junction-the outer layer-the transition hole.printed circuit boardstacktopological modelinghyperlynxprinted circuit board materials |
| spellingShingle | P.A. Maksimov A.S. Ishkov M.K. Markelov INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITY Измерение, мониторинг, управление, контроль printed circuit board stack topological modeling hyperlynx printed circuit board materials |
| title | INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITY |
| title_full | INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITY |
| title_fullStr | INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITY |
| title_full_unstemmed | INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITY |
| title_short | INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITY |
| title_sort | investigation of the influence of information security cell stack material parameters on its reliability |
| topic | printed circuit board stack topological modeling hyperlynx printed circuit board materials |
| work_keys_str_mv | AT pamaksimov investigationoftheinfluenceofinformationsecuritycellstackmaterialparametersonitsreliability AT asishkov investigationoftheinfluenceofinformationsecuritycellstackmaterialparametersonitsreliability AT mkmarkelov investigationoftheinfluenceofinformationsecuritycellstackmaterialparametersonitsreliability |