High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate
Silicon carbide (SiC) ceramics are widely used as structural materials for various applications. However, the extraordinarily high hardness, brittleness, low material removal rate, and severe tool wear of these materials significantly impact the performance of conventional mechanical processing tech...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-10-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/10/1960 |
| _version_ | 1827720409473089536 |
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| author | Jian Zhang Zhichao Liu Yuanhang Zhang Feng Geng Shengfei Wang Fei Fan Qinghua Zhang Qiao Xu |
| author_facet | Jian Zhang Zhichao Liu Yuanhang Zhang Feng Geng Shengfei Wang Fei Fan Qinghua Zhang Qiao Xu |
| author_sort | Jian Zhang |
| collection | DOAJ |
| description | Silicon carbide (SiC) ceramics are widely used as structural materials for various applications. However, the extraordinarily high hardness, brittleness, low material removal rate, and severe tool wear of these materials significantly impact the performance of conventional mechanical processing techniques. In this study, we investigated the influence of different parameters on the material removal rate, surface quality, and surface oxidation during the laser processing of SiC ceramic samples using a high-repetition-frequency femtosecond laser at a wavelength of 1030 nm. Additionally, an experimental investigation was conducted to analyze the effects of a burst mode on the material removal rate. Our results demonstrate that the surface oxidation, which significantly affects the material removal rate, can be effectively reduced by increasing the laser scanning speed and decreasing the laser scanning pitch. The material removal rate and surface quality are mainly affected by laser fluence. The optimal material removal rate is obtained with a laser fluence of 0.4 J/cm<sup>2</sup> at a pulse width of 470 fs. |
| first_indexed | 2024-03-10T21:02:52Z |
| format | Article |
| id | doaj.art-ae42ad247cf44688a31159690592d29f |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T21:02:52Z |
| publishDate | 2023-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-ae42ad247cf44688a31159690592d29f2023-11-19T17:25:25ZengMDPI AGMicromachines2072-666X2023-10-011410196010.3390/mi14101960High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal RateJian Zhang0Zhichao Liu1Yuanhang Zhang2Feng Geng3Shengfei Wang4Fei Fan5Qinghua Zhang6Qiao Xu7Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, ChinaLaser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, ChinaLaser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, ChinaLaser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, ChinaLaser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, ChinaLaser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, ChinaLaser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, ChinaLaser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, ChinaSilicon carbide (SiC) ceramics are widely used as structural materials for various applications. However, the extraordinarily high hardness, brittleness, low material removal rate, and severe tool wear of these materials significantly impact the performance of conventional mechanical processing techniques. In this study, we investigated the influence of different parameters on the material removal rate, surface quality, and surface oxidation during the laser processing of SiC ceramic samples using a high-repetition-frequency femtosecond laser at a wavelength of 1030 nm. Additionally, an experimental investigation was conducted to analyze the effects of a burst mode on the material removal rate. Our results demonstrate that the surface oxidation, which significantly affects the material removal rate, can be effectively reduced by increasing the laser scanning speed and decreasing the laser scanning pitch. The material removal rate and surface quality are mainly affected by laser fluence. The optimal material removal rate is obtained with a laser fluence of 0.4 J/cm<sup>2</sup> at a pulse width of 470 fs.https://www.mdpi.com/2072-666X/14/10/1960femtosecond laserSiC ceramicslaser processingmaterial removal ratesurface oxidation |
| spellingShingle | Jian Zhang Zhichao Liu Yuanhang Zhang Feng Geng Shengfei Wang Fei Fan Qinghua Zhang Qiao Xu High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate Micromachines femtosecond laser SiC ceramics laser processing material removal rate surface oxidation |
| title | High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate |
| title_full | High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate |
| title_fullStr | High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate |
| title_full_unstemmed | High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate |
| title_short | High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate |
| title_sort | high power femtosecond laser processing of sic ceramics with optimized material removal rate |
| topic | femtosecond laser SiC ceramics laser processing material removal rate surface oxidation |
| url | https://www.mdpi.com/2072-666X/14/10/1960 |
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