A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation
Abstract Lamination of a thin film encapsulation (TFE) layer is regarded as one of the most promising methods that enable the reliable operation of organic electronic devices by attaching the TFE layers thereon directly using an adhesive layer. In this study, a low-temperature curable adhe...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Georg Thieme Verlag
2023-02-01
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| Series: | Organic Materials |
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| Online Access: | http://www.thieme-connect.de/DOI/DOI?10.1055/a-2012-2147 |
| _version_ | 1811165002197893120 |
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| author | Yong Cheon Park Kihoon Jeong Dahye Ahn Youson Kim Sung Gap Im |
| author_facet | Yong Cheon Park Kihoon Jeong Dahye Ahn Youson Kim Sung Gap Im |
| author_sort | Yong Cheon Park |
| collection | DOAJ |
| description | Abstract
Lamination of a thin film encapsulation (TFE) layer is regarded as one of the most promising methods that enable the reliable operation of organic electronic devices by attaching the TFE layers thereon directly using an adhesive layer. In this study, a low-temperature curable adhesive thin film with low glass transition temperature (T
g) is newly designed and synthesized. Low T
g allows conformal contact at the interface of the adhesive layer and the substrate subsequently leads to the enhancement of adhesion, and thus the barrier performance of the lamination of barrier film increases. In order to fabricate a low-T
g adhesive layer, glycidyl methacrylate (GMA) was copolymerized with a 2-hydroxyethyl acrylate (HEA) monomer in the vapor phase via initiated chemical vapor deposition. With a 5 µm thick p(GMA-co-HEA) adhesive layer, a strong adhesion was readily achieved by curing it at 60 °C for 1 h, with the peel strength of 16.6 N/25 mm, and the water vapor transmission rate of the glass-laminated encapsulation was as low as 3.4 × 10−3 g/m2 · day under accelerating conditions (38 °C, 90% relative humidity). We believe the low-temperature curable thin adhesive layer will serve as a powerful material for the lamination of organic electronic devices in a damage-free way. |
| first_indexed | 2024-04-10T15:30:31Z |
| format | Article |
| id | doaj.art-ae91803578304fa8805efa1ab485bd5a |
| institution | Directory Open Access Journal |
| issn | 2625-1825 |
| language | English |
| last_indexed | 2024-04-10T15:30:31Z |
| publishDate | 2023-02-01 |
| publisher | Georg Thieme Verlag |
| record_format | Article |
| series | Organic Materials |
| spelling | doaj.art-ae91803578304fa8805efa1ab485bd5a2023-02-14T00:26:46ZengGeorg Thieme VerlagOrganic Materials2625-18252023-02-01501667110.1055/a-2012-2147A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film EncapsulationYong Cheon Park0Kihoon Jeong1Dahye Ahn2Youson Kim3Sung Gap Im4These authors contributed equally to this work.These authors contributed equally to this work.Department of Chemical & Biomolecular Engineering, Korea Advanced Institute of Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of KoreaDepartment of Chemical & Biomolecular Engineering, Korea Advanced Institute of Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of KoreaDepartment of Chemical & Biomolecular Engineering, Korea Advanced Institute of Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of KoreaAbstract Lamination of a thin film encapsulation (TFE) layer is regarded as one of the most promising methods that enable the reliable operation of organic electronic devices by attaching the TFE layers thereon directly using an adhesive layer. In this study, a low-temperature curable adhesive thin film with low glass transition temperature (T g) is newly designed and synthesized. Low T g allows conformal contact at the interface of the adhesive layer and the substrate subsequently leads to the enhancement of adhesion, and thus the barrier performance of the lamination of barrier film increases. In order to fabricate a low-T g adhesive layer, glycidyl methacrylate (GMA) was copolymerized with a 2-hydroxyethyl acrylate (HEA) monomer in the vapor phase via initiated chemical vapor deposition. With a 5 µm thick p(GMA-co-HEA) adhesive layer, a strong adhesion was readily achieved by curing it at 60 °C for 1 h, with the peel strength of 16.6 N/25 mm, and the water vapor transmission rate of the glass-laminated encapsulation was as low as 3.4 × 10−3 g/m2 · day under accelerating conditions (38 °C, 90% relative humidity). We believe the low-temperature curable thin adhesive layer will serve as a powerful material for the lamination of organic electronic devices in a damage-free way.http://www.thieme-connect.de/DOI/DOI?10.1055/a-2012-2147initiated chemical vapor deposition (icvd)thin film encapsulation (tfe)low-t g adhesive |
| spellingShingle | Yong Cheon Park Kihoon Jeong Dahye Ahn Youson Kim Sung Gap Im A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation Organic Materials initiated chemical vapor deposition (icvd) thin film encapsulation (tfe) low-t g adhesive |
| title | A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation |
| title_full | A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation |
| title_fullStr | A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation |
| title_full_unstemmed | A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation |
| title_short | A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation |
| title_sort | low temperature curable conformal adhesive layer for monolithic lamination of thin film encapsulation |
| topic | initiated chemical vapor deposition (icvd) thin film encapsulation (tfe) low-t g adhesive |
| url | http://www.thieme-connect.de/DOI/DOI?10.1055/a-2012-2147 |
| work_keys_str_mv | AT yongcheonpark alowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT kihoonjeong alowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT dahyeahn alowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT yousonkim alowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT sunggapim alowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT yongcheonpark lowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT kihoonjeong lowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT dahyeahn lowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT yousonkim lowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation AT sunggapim lowtemperaturecurableconformaladhesivelayerformonolithiclaminationofthinfilmencapsulation |