A Low-Temperature Curable Conformal Adhesive Layer for Monolithic Lamination of Thin Film Encapsulation
Abstract Lamination of a thin film encapsulation (TFE) layer is regarded as one of the most promising methods that enable the reliable operation of organic electronic devices by attaching the TFE layers thereon directly using an adhesive layer. In this study, a low-temperature curable adhe...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Georg Thieme Verlag
2023-02-01
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| Series: | Organic Materials |
| Subjects: | |
| Online Access: | http://www.thieme-connect.de/DOI/DOI?10.1055/a-2012-2147 |