Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling

Soldering in a reflow oven is an important and efficient technical means to produce integrated circuit boards. The key to the quality of integrated circuit boards lies in the furnace temperature curve. In this paper, Newton’s law of cooling is used to establish the mechanism model of the temperature...

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Main Authors: Bo-yang Li, Shi-you Lin, Li-sha Chen, Ming-yuan Zhao
Format: Article
Language:English
Published: MDPI AG 2023-03-01
Series:Symmetry
Subjects:
Online Access:https://www.mdpi.com/2073-8994/15/3/661
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author Bo-yang Li
Shi-you Lin
Li-sha Chen
Ming-yuan Zhao
author_facet Bo-yang Li
Shi-you Lin
Li-sha Chen
Ming-yuan Zhao
author_sort Bo-yang Li
collection DOAJ
description Soldering in a reflow oven is an important and efficient technical means to produce integrated circuit boards. The key to the quality of integrated circuit boards lies in the furnace temperature curve. In this paper, Newton’s law of cooling is used to establish the mechanism model of the temperature of each zone of the furnace and the curve of furnace temperature, which can reduce the number of experiments in actual production and obtain a better furnace temperature curve, thus improving production efficiency. Finally, several concrete examples are given to discuss and solve some common problems in the industry.
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spelling doaj.art-af040d690de44039b85b47b819c72e932023-11-17T14:09:08ZengMDPI AGSymmetry2073-89942023-03-0115366110.3390/sym15030661Temperature Curve of Reflow Furnace Based on Newton’s Law of CoolingBo-yang Li0Shi-you Lin1Li-sha Chen2Ming-yuan Zhao3School of Mathematics and Statistics, Hainan Normal University, Haikou 571158, ChinaSchool of Mathematics and Statistics, Hainan Normal University, Haikou 571158, ChinaSchool of Mathematics and Statistics, Hainan Normal University, Haikou 571158, ChinaSchool of Mathematics and Statistics, Hainan Normal University, Haikou 571158, ChinaSoldering in a reflow oven is an important and efficient technical means to produce integrated circuit boards. The key to the quality of integrated circuit boards lies in the furnace temperature curve. In this paper, Newton’s law of cooling is used to establish the mechanism model of the temperature of each zone of the furnace and the curve of furnace temperature, which can reduce the number of experiments in actual production and obtain a better furnace temperature curve, thus improving production efficiency. Finally, several concrete examples are given to discuss and solve some common problems in the industry.https://www.mdpi.com/2073-8994/15/3/661furnace temperature curveNewton’s law of coolingheat transfer coefficientEuler methodinterpolation
spellingShingle Bo-yang Li
Shi-you Lin
Li-sha Chen
Ming-yuan Zhao
Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling
Symmetry
furnace temperature curve
Newton’s law of cooling
heat transfer coefficient
Euler method
interpolation
title Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling
title_full Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling
title_fullStr Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling
title_full_unstemmed Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling
title_short Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling
title_sort temperature curve of reflow furnace based on newton s law of cooling
topic furnace temperature curve
Newton’s law of cooling
heat transfer coefficient
Euler method
interpolation
url https://www.mdpi.com/2073-8994/15/3/661
work_keys_str_mv AT boyangli temperaturecurveofreflowfurnacebasedonnewtonslawofcooling
AT shiyoulin temperaturecurveofreflowfurnacebasedonnewtonslawofcooling
AT lishachen temperaturecurveofreflowfurnacebasedonnewtonslawofcooling
AT mingyuanzhao temperaturecurveofreflowfurnacebasedonnewtonslawofcooling