Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling
Soldering in a reflow oven is an important and efficient technical means to produce integrated circuit boards. The key to the quality of integrated circuit boards lies in the furnace temperature curve. In this paper, Newton’s law of cooling is used to establish the mechanism model of the temperature...
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Format: | Article |
Language: | English |
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MDPI AG
2023-03-01
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Series: | Symmetry |
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Online Access: | https://www.mdpi.com/2073-8994/15/3/661 |
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author | Bo-yang Li Shi-you Lin Li-sha Chen Ming-yuan Zhao |
author_facet | Bo-yang Li Shi-you Lin Li-sha Chen Ming-yuan Zhao |
author_sort | Bo-yang Li |
collection | DOAJ |
description | Soldering in a reflow oven is an important and efficient technical means to produce integrated circuit boards. The key to the quality of integrated circuit boards lies in the furnace temperature curve. In this paper, Newton’s law of cooling is used to establish the mechanism model of the temperature of each zone of the furnace and the curve of furnace temperature, which can reduce the number of experiments in actual production and obtain a better furnace temperature curve, thus improving production efficiency. Finally, several concrete examples are given to discuss and solve some common problems in the industry. |
first_indexed | 2024-03-11T05:50:30Z |
format | Article |
id | doaj.art-af040d690de44039b85b47b819c72e93 |
institution | Directory Open Access Journal |
issn | 2073-8994 |
language | English |
last_indexed | 2024-03-11T05:50:30Z |
publishDate | 2023-03-01 |
publisher | MDPI AG |
record_format | Article |
series | Symmetry |
spelling | doaj.art-af040d690de44039b85b47b819c72e932023-11-17T14:09:08ZengMDPI AGSymmetry2073-89942023-03-0115366110.3390/sym15030661Temperature Curve of Reflow Furnace Based on Newton’s Law of CoolingBo-yang Li0Shi-you Lin1Li-sha Chen2Ming-yuan Zhao3School of Mathematics and Statistics, Hainan Normal University, Haikou 571158, ChinaSchool of Mathematics and Statistics, Hainan Normal University, Haikou 571158, ChinaSchool of Mathematics and Statistics, Hainan Normal University, Haikou 571158, ChinaSchool of Mathematics and Statistics, Hainan Normal University, Haikou 571158, ChinaSoldering in a reflow oven is an important and efficient technical means to produce integrated circuit boards. The key to the quality of integrated circuit boards lies in the furnace temperature curve. In this paper, Newton’s law of cooling is used to establish the mechanism model of the temperature of each zone of the furnace and the curve of furnace temperature, which can reduce the number of experiments in actual production and obtain a better furnace temperature curve, thus improving production efficiency. Finally, several concrete examples are given to discuss and solve some common problems in the industry.https://www.mdpi.com/2073-8994/15/3/661furnace temperature curveNewton’s law of coolingheat transfer coefficientEuler methodinterpolation |
spellingShingle | Bo-yang Li Shi-you Lin Li-sha Chen Ming-yuan Zhao Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling Symmetry furnace temperature curve Newton’s law of cooling heat transfer coefficient Euler method interpolation |
title | Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling |
title_full | Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling |
title_fullStr | Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling |
title_full_unstemmed | Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling |
title_short | Temperature Curve of Reflow Furnace Based on Newton’s Law of Cooling |
title_sort | temperature curve of reflow furnace based on newton s law of cooling |
topic | furnace temperature curve Newton’s law of cooling heat transfer coefficient Euler method interpolation |
url | https://www.mdpi.com/2073-8994/15/3/661 |
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