Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network
Carbon nanotubes (CNTs) are long considered as a promising material for thermal applications. However, problems such as low volume CNT fraction abhorrent to practical applications have been raising the demand for novel architecture of this material. Here we demonstrate two fabrication methods, in wh...
| Main Authors: | , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2019-01-01
|
| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/ab1e60 |
| _version_ | 1797747254646276096 |
|---|---|
| author | Majid Kabiri Samani Congxiang Lu Kong Qinyu Narjes Khosravian George Chen Chong Wei Tan Per Rudquist Beng Kang Tay Johan Liu |
| author_facet | Majid Kabiri Samani Congxiang Lu Kong Qinyu Narjes Khosravian George Chen Chong Wei Tan Per Rudquist Beng Kang Tay Johan Liu |
| author_sort | Majid Kabiri Samani |
| collection | DOAJ |
| description | Carbon nanotubes (CNTs) are long considered as a promising material for thermal applications. However, problems such as low volume CNT fraction abhorrent to practical applications have been raising the demand for novel architecture of this material. Here we demonstrate two fabrication methods, in which a self-assembly method for fabricating covalent-bonded CNT network (3D CNT) and another method for covalent-bonded C to CNTs (C@CNT) network, and presented both as a potential method to enhance thermal conductivity of CNT arrays. We utilized pulsed photothermal reflectance technique and using new four-layer heat conduction model based on the transmission-line theory to measure thermal conductivity of the samples. The 3D CNT with thermal conductivity of 21 W mK ^−1 and C@CNT with thermal conductivity of 26 W mK ^−1 turn out to be an excellent candidate for thermal interface material as the thermal conductivity increased by 40% and 70% respectively as compared to conventional CNT arrays. The improvement is attributed to the efficient thermal routines constructed between CNTs and secondary CNTs in 3D CNT and between C layer and CNTs in C@CNT. The other factor to improve thermal conductivity of the samples is decreasing air volume fraction in CNT arrays. Our fabrication methods provide a simple method but effective way to fabricate 3D CNT and C@CNT and extend the possibility of CNTs towards TIM application. |
| first_indexed | 2024-03-12T15:48:12Z |
| format | Article |
| id | doaj.art-af96b4caa2184319a4b02132e344211a |
| institution | Directory Open Access Journal |
| issn | 2053-1591 |
| language | English |
| last_indexed | 2024-03-12T15:48:12Z |
| publishDate | 2019-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | Materials Research Express |
| spelling | doaj.art-af96b4caa2184319a4b02132e344211a2023-08-09T15:20:19ZengIOP PublishingMaterials Research Express2053-15912019-01-016808561610.1088/2053-1591/ab1e60Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube networkMajid Kabiri Samani0Congxiang Lu1Kong Qinyu2Narjes Khosravian3George Chen4Chong Wei Tan5https://orcid.org/0000-0002-9540-8708Per Rudquist6Beng Kang Tay7Johan Liu8https://orcid.org/0000-0001-9931-1439Electronics Materials and Systems Laboratory (EMSL), Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology , Kemivägen 9, SE-412 96 Göteborg, SwedenCenter for Micro/Nano-electronics (NOVITAS), School of Electrical and Electronic Engineering, Nanyang Technological University , 639798, Singapore; Ningbo Cataglyphis Intelligent Technology Co., Ltd, Ningbo Hi-Tech Park, Zhejiang 315000, People’s Republic of ChinaCenter for Micro/Nano-electronics (NOVITAS), School of Electrical and Electronic Engineering, Nanyang Technological University , 639798, SingaporeDepartment of Physics, Chalmers University of Technology , Kemivägen 10, 412 96 Gothenburg, SwedenBC Photonics Technological Co., Richmond, BC V7E 1G9, CanadaCenter for Micro/Nano-electronics (NOVITAS), School of Electrical and Electronic Engineering, Nanyang Technological University , 639798, SingaporeElectronics Materials and Systems Laboratory (EMSL), Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology , Kemivägen 9, SE-412 96 Göteborg, SwedenCenter for Micro/Nano-electronics (NOVITAS), School of Electrical and Electronic Engineering, Nanyang Technological University , 639798, Singapore; CINTRA, CNRS International NTU THALES Research Alliance, Research Techno Plaza, 50 Nanyang Drive, Border X Block, Level 6, 637553, SingaporeElectronics Materials and Systems Laboratory (EMSL), Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology , Kemivägen 9, SE-412 96 Göteborg, Sweden; SMIT Center, School of Mechanical Engineering and Automation, Shanghai University , No 20, Chengzhong Road, 201800, People’s Republic of ChinaCarbon nanotubes (CNTs) are long considered as a promising material for thermal applications. However, problems such as low volume CNT fraction abhorrent to practical applications have been raising the demand for novel architecture of this material. Here we demonstrate two fabrication methods, in which a self-assembly method for fabricating covalent-bonded CNT network (3D CNT) and another method for covalent-bonded C to CNTs (C@CNT) network, and presented both as a potential method to enhance thermal conductivity of CNT arrays. We utilized pulsed photothermal reflectance technique and using new four-layer heat conduction model based on the transmission-line theory to measure thermal conductivity of the samples. The 3D CNT with thermal conductivity of 21 W mK ^−1 and C@CNT with thermal conductivity of 26 W mK ^−1 turn out to be an excellent candidate for thermal interface material as the thermal conductivity increased by 40% and 70% respectively as compared to conventional CNT arrays. The improvement is attributed to the efficient thermal routines constructed between CNTs and secondary CNTs in 3D CNT and between C layer and CNTs in C@CNT. The other factor to improve thermal conductivity of the samples is decreasing air volume fraction in CNT arrays. Our fabrication methods provide a simple method but effective way to fabricate 3D CNT and C@CNT and extend the possibility of CNTs towards TIM application.https://doi.org/10.1088/2053-1591/ab1e60CNT array3D CNT networkthermal conductivitythermal interface materials |
| spellingShingle | Majid Kabiri Samani Congxiang Lu Kong Qinyu Narjes Khosravian George Chen Chong Wei Tan Per Rudquist Beng Kang Tay Johan Liu Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network Materials Research Express CNT array 3D CNT network thermal conductivity thermal interface materials |
| title | Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network |
| title_full | Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network |
| title_fullStr | Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network |
| title_full_unstemmed | Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network |
| title_short | Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network |
| title_sort | thermal conductivity enhancement of carbon carbon nanotube arrays and bonded carbon nanotube network |
| topic | CNT array 3D CNT network thermal conductivity thermal interface materials |
| url | https://doi.org/10.1088/2053-1591/ab1e60 |
| work_keys_str_mv | AT majidkabirisamani thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork AT congxianglu thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork AT kongqinyu thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork AT narjeskhosravian thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork AT georgechen thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork AT chongweitan thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork AT perrudquist thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork AT bengkangtay thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork AT johanliu thermalconductivityenhancementofcarboncarbonnanotubearraysandbondedcarbonnanotubenetwork |