Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition
The joining of Ti and Ni at low temperatures was analysed in this work. For joining pure Ti and Ni coins of 1.5 mm in thickness were used. Reactive multilayer thin films/foils with nanometric period (bilayer thickness), in particular Ni/Al multilayers, have been used to promote joining in two thickn...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Publishing Agency - Welding Technology Review
2019-11-01
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| Series: | Przegląd Spawalnictwa |
| Subjects: | |
| Online Access: | http://www.pspaw.pl/index.php/pspaw/article/view/1073 |