First-Principles Study on the Impact of Stress on Depassivation of Defects at a-SiO2/Si Interfaces

The amorphous silicon dioxide-silicon (a-SiO2/Si) interface is an important part of silicon devices. It is difficult to avoid interface defects during the device production process. The passivated interface defects will undergo a depassivation reaction with the protons in the silicon dioxide generat...

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Main Authors: Xin Liu, Yang Liu, Hao-Ran Zhu, Xue-Hua Liu, Wen-Li Zhang, Xu Zuo
Format: Article
Language:English
Published: Frontiers Media S.A. 2022-05-01
Series:Frontiers in Materials
Subjects:
Online Access:https://www.frontiersin.org/articles/10.3389/fmats.2022.872837/full
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author Xin Liu
Yang Liu
Yang Liu
Hao-Ran Zhu
Xue-Hua Liu
Wen-Li Zhang
Xu Zuo
Xu Zuo
Xu Zuo
author_facet Xin Liu
Yang Liu
Yang Liu
Hao-Ran Zhu
Xue-Hua Liu
Wen-Li Zhang
Xu Zuo
Xu Zuo
Xu Zuo
author_sort Xin Liu
collection DOAJ
description The amorphous silicon dioxide-silicon (a-SiO2/Si) interface is an important part of silicon devices. It is difficult to avoid interface defects during the device production process. The passivated interface defects will undergo a depassivation reaction with the protons in the silicon dioxide generated by irradiation and convert to positively charged dangling bonds, thereby affecting device performance. In engineering practice, there is a final passivation layer on top of a-SiO2, and it is inevitable to introduce stress on the a-SiO2/Si interface. Therefore, studying the depassivation reaction mechanism of a-SiO2/Si interface defects under stress is of great significance to understand the performance degeneration in real devices. By using molecular dynamics and first-principles calculations, Pb defects at a-SiO2/Si (111) interface and Pb1 defects at a-SiO2/Si (100) interface are selected in this work to investigate the effect of stress on their depassivations. Biaxial strains are applied to the models, energy curves of the depassivation reactions under stress are calculated using the CI-NEB (Climbing Image Nudged Elastic Band) method, and transition states are identified. According to the Harmonic Transition State Theory (HTST), the reaction rate constants of the depassivation reactions of Pb and Pb1 defects at a certain temperature can be obtained. Finally, the relative concentration curves during depassivation reactions of PbH and Pb1H under stress and room temperature are obtained. Detailed data and figure analyses are presented to demonstrate differences between the two typical interface defects when depassivating under stress. Appropriate degrees of interface stress are proved to extend the depassivation time of defects, therefore prolonging the service life of devices.
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spelling doaj.art-b0c5184bd8964885b46e63ccf4e1922e2022-12-22T01:54:00ZengFrontiers Media S.A.Frontiers in Materials2296-80162022-05-01910.3389/fmats.2022.872837872837First-Principles Study on the Impact of Stress on Depassivation of Defects at a-SiO2/Si InterfacesXin Liu0Yang Liu1Yang Liu2Hao-Ran Zhu3Xue-Hua Liu4Wen-Li Zhang5Xu Zuo6Xu Zuo7Xu Zuo8College of Electronic Information and Optical Engineering, Nankai University, Tianjin, ChinaMicrosystem and Terahertz Research Center, China Academy of Engineering Physics, Chengdu, ChinaInstitute of Electronic Engineering, China Academy of Engineering Physics, Mianyang, ChinaCollege of Electronic Information and Optical Engineering, Nankai University, Tianjin, ChinaCollege of Electronic Information and Optical Engineering, Nankai University, Tianjin, ChinaCollege of Electronic Information and Optical Engineering, Nankai University, Tianjin, ChinaCollege of Electronic Information and Optical Engineering, Nankai University, Tianjin, ChinaKey Laboratory of Photoelectronic Thin Film Devices and Technology of Tianjin, Nankai University, Tianjin, ChinaEngineering Research Center of Thin Film Optoelectronics Technology, Ministry of Education, Nankai University, Tianjin, ChinaThe amorphous silicon dioxide-silicon (a-SiO2/Si) interface is an important part of silicon devices. It is difficult to avoid interface defects during the device production process. The passivated interface defects will undergo a depassivation reaction with the protons in the silicon dioxide generated by irradiation and convert to positively charged dangling bonds, thereby affecting device performance. In engineering practice, there is a final passivation layer on top of a-SiO2, and it is inevitable to introduce stress on the a-SiO2/Si interface. Therefore, studying the depassivation reaction mechanism of a-SiO2/Si interface defects under stress is of great significance to understand the performance degeneration in real devices. By using molecular dynamics and first-principles calculations, Pb defects at a-SiO2/Si (111) interface and Pb1 defects at a-SiO2/Si (100) interface are selected in this work to investigate the effect of stress on their depassivations. Biaxial strains are applied to the models, energy curves of the depassivation reactions under stress are calculated using the CI-NEB (Climbing Image Nudged Elastic Band) method, and transition states are identified. According to the Harmonic Transition State Theory (HTST), the reaction rate constants of the depassivation reactions of Pb and Pb1 defects at a certain temperature can be obtained. Finally, the relative concentration curves during depassivation reactions of PbH and Pb1H under stress and room temperature are obtained. Detailed data and figure analyses are presented to demonstrate differences between the two typical interface defects when depassivating under stress. Appropriate degrees of interface stress are proved to extend the depassivation time of defects, therefore prolonging the service life of devices.https://www.frontiersin.org/articles/10.3389/fmats.2022.872837/fullfirst-principles calculationdepassivationPb-type defectsstressa-SiO2/Si interfaces
spellingShingle Xin Liu
Yang Liu
Yang Liu
Hao-Ran Zhu
Xue-Hua Liu
Wen-Li Zhang
Xu Zuo
Xu Zuo
Xu Zuo
First-Principles Study on the Impact of Stress on Depassivation of Defects at a-SiO2/Si Interfaces
Frontiers in Materials
first-principles calculation
depassivation
Pb-type defects
stress
a-SiO2/Si interfaces
title First-Principles Study on the Impact of Stress on Depassivation of Defects at a-SiO2/Si Interfaces
title_full First-Principles Study on the Impact of Stress on Depassivation of Defects at a-SiO2/Si Interfaces
title_fullStr First-Principles Study on the Impact of Stress on Depassivation of Defects at a-SiO2/Si Interfaces
title_full_unstemmed First-Principles Study on the Impact of Stress on Depassivation of Defects at a-SiO2/Si Interfaces
title_short First-Principles Study on the Impact of Stress on Depassivation of Defects at a-SiO2/Si Interfaces
title_sort first principles study on the impact of stress on depassivation of defects at a sio2 si interfaces
topic first-principles calculation
depassivation
Pb-type defects
stress
a-SiO2/Si interfaces
url https://www.frontiersin.org/articles/10.3389/fmats.2022.872837/full
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