Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface

Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface

The precise control and understanding of heat flow in heterostructures is pivotal for advancements in thermoelectric energy conversion, thermal barrier coatings, and efficient heat management in electronic and optoelectronic devices. In this study, we employ high-angular-resolution time-resolved X-r...

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Bibliographic Details
Main Authors: Joohyun Lee, Wonhyuk Jo, Ji-Hwan Kwon, Bruce Griffin, Byeong-Gwan Cho, Eric C. Landahl, Sooheyong Lee
Format: Article
Language:English
Published: MDPI AG 2023-11-01
Series:Materials
Subjects:
time-resolved X-ray diffraction
thermal transport
semiconductor
interface
nanoscale
heterostructure
Online Access:https://www.mdpi.com/1996-1944/16/23/7450

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