Effects of Residual Stress Distribution on Interfacial Adhesion of Magnetron Sputtered AlN and AlN/Al Nanostructured Coatings on a (100) Silicon Substrate

Effects of Residual Stress Distribution on Interfacial Adhesion of Magnetron Sputtered AlN and AlN/Al Nanostructured Coatings on a (100) Silicon Substrate

The present study investigated the influence of nanoscale residual stress depth gradients on the nano-mechanical behavior and adhesion energy of aluminium nitride (AlN) and Al/AlN sputtered thin films on a (100) silicon substrate. By using a focused ion beam (FIB) incremental ring-core method, the r...

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Bibliographic Details
Main Authors: Rashid Ali, Marco Renzelli, M. Imran Khan, Marco Sebastiani, Edoardo Bemporad
Format: Article
Language:English
Published: MDPI AG 2018-11-01
Series:Nanomaterials
Subjects:
physical vapor deposition
magnetron sputtering
AlN/Al coating
silicon substrate
residual stresses
wafer curvature method
nanoscale residual stress profiling
indentation failure modes
nanoindentation adhesion
Online Access:https://www.mdpi.com/2079-4991/8/11/896

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