Utilization of legume flours in wafer sheets
Abstract In this study, it was aimed to analyze the impacts of replacement of 20% of wheat flour by lentil, chickpea, or bean flours on batter rheology as well as hardness, weight loss, sorption characteristics, and color of the wafer sheets. All formulations showed shear thinning behavior obeying p...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2020-03-01
|
| Series: | Legume Science |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/leg3.12 |
| _version_ | 1819123615235309568 |
|---|---|
| author | Busra Tufan Serpil Sahin Gulum Sumnu |
| author_facet | Busra Tufan Serpil Sahin Gulum Sumnu |
| author_sort | Busra Tufan |
| collection | DOAJ |
| description | Abstract In this study, it was aimed to analyze the impacts of replacement of 20% of wheat flour by lentil, chickpea, or bean flours on batter rheology as well as hardness, weight loss, sorption characteristics, and color of the wafer sheets. All formulations showed shear thinning behavior obeying power law. Lentil flour‐containing formula gave the highest flow behavior index and the lowest consistency coefficient value. Hardness of wafer sheets increased when legume flours were used. Increase in hardness value was less when chickpea flour was used as compared with the other legume flours. It was observed that upon baking, legume flour‐added samples had lower weight loss values. Usage of chickpea flour resulted in the lowest weight loss. Sorption results implied localized sorption indicating multilayer water molecules showing similar properties to liquid water. Wafers containing legume flours were not significantly different than the control wafer in terms of monolayer moisture content, K and C values of Gugenheim, Anderson and de Boer (GAB) model. The color of chickpea flour‐containing wafer was the closest to that of control sample. Overall, wafer sheets prepared by replacement of 20% wheat flour by chickpea flour was agreed to be the best in terms of the analyzed parameters. |
| first_indexed | 2024-12-22T07:11:10Z |
| format | Article |
| id | doaj.art-b4490a0539d44994b7c6e716792d112b |
| institution | Directory Open Access Journal |
| issn | 2639-6181 |
| language | English |
| last_indexed | 2024-12-22T07:11:10Z |
| publishDate | 2020-03-01 |
| publisher | Wiley |
| record_format | Article |
| series | Legume Science |
| spelling | doaj.art-b4490a0539d44994b7c6e716792d112b2022-12-21T18:34:31ZengWileyLegume Science2639-61812020-03-0121n/an/a10.1002/leg3.12Utilization of legume flours in wafer sheetsBusra Tufan0Serpil Sahin1Gulum Sumnu2Department of Food Engineering Middle East Technical University Ankara TurkeyDepartment of Food Engineering Middle East Technical University Ankara TurkeyDepartment of Food Engineering Middle East Technical University Ankara TurkeyAbstract In this study, it was aimed to analyze the impacts of replacement of 20% of wheat flour by lentil, chickpea, or bean flours on batter rheology as well as hardness, weight loss, sorption characteristics, and color of the wafer sheets. All formulations showed shear thinning behavior obeying power law. Lentil flour‐containing formula gave the highest flow behavior index and the lowest consistency coefficient value. Hardness of wafer sheets increased when legume flours were used. Increase in hardness value was less when chickpea flour was used as compared with the other legume flours. It was observed that upon baking, legume flour‐added samples had lower weight loss values. Usage of chickpea flour resulted in the lowest weight loss. Sorption results implied localized sorption indicating multilayer water molecules showing similar properties to liquid water. Wafers containing legume flours were not significantly different than the control wafer in terms of monolayer moisture content, K and C values of Gugenheim, Anderson and de Boer (GAB) model. The color of chickpea flour‐containing wafer was the closest to that of control sample. Overall, wafer sheets prepared by replacement of 20% wheat flour by chickpea flour was agreed to be the best in terms of the analyzed parameters.https://doi.org/10.1002/leg3.12bean flourchickpea flourlentil flourphysical propertieswafer sheet |
| spellingShingle | Busra Tufan Serpil Sahin Gulum Sumnu Utilization of legume flours in wafer sheets Legume Science bean flour chickpea flour lentil flour physical properties wafer sheet |
| title | Utilization of legume flours in wafer sheets |
| title_full | Utilization of legume flours in wafer sheets |
| title_fullStr | Utilization of legume flours in wafer sheets |
| title_full_unstemmed | Utilization of legume flours in wafer sheets |
| title_short | Utilization of legume flours in wafer sheets |
| title_sort | utilization of legume flours in wafer sheets |
| topic | bean flour chickpea flour lentil flour physical properties wafer sheet |
| url | https://doi.org/10.1002/leg3.12 |
| work_keys_str_mv | AT busratufan utilizationoflegumefloursinwafersheets AT serpilsahin utilizationoflegumefloursinwafersheets AT gulumsumnu utilizationoflegumefloursinwafersheets |