A 1200 V SiC Trench MOSFET with a Laterally Widened P-Shield Region to Enhance the Short-Circuit Ruggedness

In this paper, a novel 1200 V SiC trench MOSFET with a laterally widened P-shield region (LW-MOSFET) is presented by using the two-dimensional numerical simulation. Compared with the conventional trench MOSFET (CT-MOSFET), the LW-MOSFET demonstrates an effective enhancement on the short-circuit (SC)...

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Main Authors: Xinxin Zuo, Jiang Lu, Xinyu Liu, Yun Bai, Xiaoli Tian, Guodong Cheng, Yidan Tang, Chengyue Yang, Hong Chen
Format: Article
Language:English
Published: MDPI AG 2022-03-01
Series:Electronics
Subjects:
Online Access:https://www.mdpi.com/2079-9292/11/7/1077
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author Xinxin Zuo
Jiang Lu
Xinyu Liu
Yun Bai
Xiaoli Tian
Guodong Cheng
Yidan Tang
Chengyue Yang
Hong Chen
author_facet Xinxin Zuo
Jiang Lu
Xinyu Liu
Yun Bai
Xiaoli Tian
Guodong Cheng
Yidan Tang
Chengyue Yang
Hong Chen
author_sort Xinxin Zuo
collection DOAJ
description In this paper, a novel 1200 V SiC trench MOSFET with a laterally widened P-shield region (LW-MOSFET) is presented by using the two-dimensional numerical simulation. Compared with the conventional trench MOSFET (CT-MOSFET), the LW-MOSFET demonstrates an effective enhancement on the short-circuit (SC) reliability and the optimization of static performance simultaneously. According to the simulation results, the SC withstand time (SCWT) of the LW-MOSFET at 600 V DC bus voltage can reach 8 μs, while that of the CT-MOSFET is only 3 μs at the same conditions. The main reason is that the laterally widened P-shield region can help to suppress the saturation current and mitigate the huge current accumulation near the trench area, leading to an enhancement of the SC reliability. Moreover, the Baliga’s FOM of the proposed structure is improved by 45.7%, which benefits from the higher breakdown voltage (BV) and the lower specific on-state resistance (R<sub>on, sp</sub>) by using the optimized structure. The advantage of static performance is related to the local charge balance behavior provided by the laterally widened P-shield region, which helps to use a higher doped current spread layer (CSL) without bringing a degeneration of BV.
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spelling doaj.art-b460c764a3ee436a994cd9ec039adcaf2023-11-30T23:07:03ZengMDPI AGElectronics2079-92922022-03-01117107710.3390/electronics11071077A 1200 V SiC Trench MOSFET with a Laterally Widened P-Shield Region to Enhance the Short-Circuit RuggednessXinxin Zuo0Jiang Lu1Xinyu Liu2Yun Bai3Xiaoli Tian4Guodong Cheng5Yidan Tang6Chengyue Yang7Hong Chen8Institute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaIn this paper, a novel 1200 V SiC trench MOSFET with a laterally widened P-shield region (LW-MOSFET) is presented by using the two-dimensional numerical simulation. Compared with the conventional trench MOSFET (CT-MOSFET), the LW-MOSFET demonstrates an effective enhancement on the short-circuit (SC) reliability and the optimization of static performance simultaneously. According to the simulation results, the SC withstand time (SCWT) of the LW-MOSFET at 600 V DC bus voltage can reach 8 μs, while that of the CT-MOSFET is only 3 μs at the same conditions. The main reason is that the laterally widened P-shield region can help to suppress the saturation current and mitigate the huge current accumulation near the trench area, leading to an enhancement of the SC reliability. Moreover, the Baliga’s FOM of the proposed structure is improved by 45.7%, which benefits from the higher breakdown voltage (BV) and the lower specific on-state resistance (R<sub>on, sp</sub>) by using the optimized structure. The advantage of static performance is related to the local charge balance behavior provided by the laterally widened P-shield region, which helps to use a higher doped current spread layer (CSL) without bringing a degeneration of BV.https://www.mdpi.com/2079-9292/11/7/1077silicon carbide (SiC)short-circuit (SC)trench MOSFETP-shield region
spellingShingle Xinxin Zuo
Jiang Lu
Xinyu Liu
Yun Bai
Xiaoli Tian
Guodong Cheng
Yidan Tang
Chengyue Yang
Hong Chen
A 1200 V SiC Trench MOSFET with a Laterally Widened P-Shield Region to Enhance the Short-Circuit Ruggedness
Electronics
silicon carbide (SiC)
short-circuit (SC)
trench MOSFET
P-shield region
title A 1200 V SiC Trench MOSFET with a Laterally Widened P-Shield Region to Enhance the Short-Circuit Ruggedness
title_full A 1200 V SiC Trench MOSFET with a Laterally Widened P-Shield Region to Enhance the Short-Circuit Ruggedness
title_fullStr A 1200 V SiC Trench MOSFET with a Laterally Widened P-Shield Region to Enhance the Short-Circuit Ruggedness
title_full_unstemmed A 1200 V SiC Trench MOSFET with a Laterally Widened P-Shield Region to Enhance the Short-Circuit Ruggedness
title_short A 1200 V SiC Trench MOSFET with a Laterally Widened P-Shield Region to Enhance the Short-Circuit Ruggedness
title_sort 1200 v sic trench mosfet with a laterally widened p shield region to enhance the short circuit ruggedness
topic silicon carbide (SiC)
short-circuit (SC)
trench MOSFET
P-shield region
url https://www.mdpi.com/2079-9292/11/7/1077
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