EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS
This paper presents the effect of filling ratio on thermal performance;of a loop thermosyphon. The experimental setup consists of an evaporator, a condenser, a riser and a downcomer. The dimensions of the loop thermosyphon under consideration were chosen so that they are mostly suitable for use i...
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| Format: | Article |
| Language: | Arabic |
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Mustansiriyah University/College of Engineering
2020-03-01
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| Series: | Journal of Engineering and Sustainable Development |
| Subjects: | |
| Online Access: | https://jeasd.uomustansiriyah.edu.iq/index.php/jeasd/article/view/145 |
| _version_ | 1797683290357891072 |
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| author | Samah Ihsan Adnan Aouf Abdulrahman Ahmad Adnan Adulamir Abdulrasool |
| author_facet | Samah Ihsan Adnan Aouf Abdulrahman Ahmad Adnan Adulamir Abdulrasool |
| author_sort | Samah Ihsan Adnan |
| collection | DOAJ |
| description |
This paper presents the effect of filling ratio on thermal performance;of a loop thermosyphon. The experimental setup consists of an evaporator, a condenser, a riser and a downcomer. The dimensions of the loop thermosyphon under consideration were chosen so that they are mostly suitable for use in the cooling of electronic components. Distilled water was used as a working fluid. Experiments were carried out to estimate the performance of the loop thermosyphon for a range of input power from 10 to 100 W. Four fill ratios were considered in the present work, namely; 15%, 25%, 50% and 85%. Results showed that the maximum value of wall temperature in evaporator was 95°C, at 100 W input power and 15% fill ratio. The fill ratio of 50% gave the minimum evaporator wall temperature which was 80°C. Increasing fill ratio tends to decrease the evaporator wall temperature for evaporator.
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| first_indexed | 2024-03-12T00:12:22Z |
| format | Article |
| id | doaj.art-b4ce30ac62ed4bb1871c469873682c4b |
| institution | Directory Open Access Journal |
| issn | 2520-0917 2520-0925 |
| language | Arabic |
| last_indexed | 2024-03-12T00:12:22Z |
| publishDate | 2020-03-01 |
| publisher | Mustansiriyah University/College of Engineering |
| record_format | Article |
| series | Journal of Engineering and Sustainable Development |
| spelling | doaj.art-b4ce30ac62ed4bb1871c469873682c4b2023-09-15T22:01:19ZaraMustansiriyah University/College of EngineeringJournal of Engineering and Sustainable Development2520-09172520-09252020-03-01242 EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONSSamah Ihsan Adnan0Aouf Abdulrahman Ahmad1Adnan Adulamir Abdulrasool2Mechanical Engineering Department, College of Engineering, Mustansiriyah University, Baghdad, IraqMechanical Engineering Department, College of Engineering, Mustansiriyah University, Baghdad, IraqMechanical Engineering Department, College of Engineering, Mustansiriyah University, Baghdad, Iraq This paper presents the effect of filling ratio on thermal performance;of a loop thermosyphon. The experimental setup consists of an evaporator, a condenser, a riser and a downcomer. The dimensions of the loop thermosyphon under consideration were chosen so that they are mostly suitable for use in the cooling of electronic components. Distilled water was used as a working fluid. Experiments were carried out to estimate the performance of the loop thermosyphon for a range of input power from 10 to 100 W. Four fill ratios were considered in the present work, namely; 15%, 25%, 50% and 85%. Results showed that the maximum value of wall temperature in evaporator was 95°C, at 100 W input power and 15% fill ratio. The fill ratio of 50% gave the minimum evaporator wall temperature which was 80°C. Increasing fill ratio tends to decrease the evaporator wall temperature for evaporator. https://jeasd.uomustansiriyah.edu.iq/index.php/jeasd/article/view/145loop heat pipethermosyphonfill ratiosaturation temperature |
| spellingShingle | Samah Ihsan Adnan Aouf Abdulrahman Ahmad Adnan Adulamir Abdulrasool EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS Journal of Engineering and Sustainable Development loop heat pipe thermosyphon fill ratio saturation temperature |
| title | EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS |
| title_full | EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS |
| title_fullStr | EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS |
| title_full_unstemmed | EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS |
| title_short | EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS |
| title_sort | effect of fill ratio on evaporator wall temperature in a loop thermosyphon used in electronic cooling applications |
| topic | loop heat pipe thermosyphon fill ratio saturation temperature |
| url | https://jeasd.uomustansiriyah.edu.iq/index.php/jeasd/article/view/145 |
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