Temperature Effects on the Compressive Behaviors of Closed-Cell Copper Foams Prepared by Powder Metallurgy

A fabrication technology of closed-cell copper foams (CCCFs) based on powder metallurgy is proposed, by using the expanded polystyrene foams (EPS) spheres with the prescribed diameter as the space holder before sintering. The material characterization and the quasi-static compressive behaviors of bo...

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Main Authors: Bin Han, Yunyu Li, Zeyu Wang, Xi Gu, Qi Zhang
Format: Article
Language:English
Published: MDPI AG 2021-10-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/14/21/6405
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author Bin Han
Yunyu Li
Zeyu Wang
Xi Gu
Qi Zhang
author_facet Bin Han
Yunyu Li
Zeyu Wang
Xi Gu
Qi Zhang
author_sort Bin Han
collection DOAJ
description A fabrication technology of closed-cell copper foams (CCCFs) based on powder metallurgy is proposed, by using the expanded polystyrene foams (EPS) spheres with the prescribed diameter as the space holder before sintering. The material characterization and the quasi-static compressive behaviors of both uniform and graded CCCFs at different temperatures were experimentally studied. A high temperature weakens the initial compressive modulus, plateau stress, and effective energy absorption for both uniform and graded CCCFs; meanwhile, the onset strain of densification and the maximum energy absorption efficiency are less sensitive to temperature, especially for the graded CCCFs. Compared with the uniform CCCF, the graded CCCF with even a small relative density exhibits superiority in terms of the effective energy absorption and the maximum energy absorption efficiency, attributed to the much larger onset strain of densification for the gradient pore arrangement. Finite element simulations based on the ideal sphere foam model can basically mimic the compressive performance of the CCCF samples. It is also found that both the decrease of pore diameter and the increase of cell wall thickness could improve the compressive performance of the CCCFs.
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spelling doaj.art-b4e6f3f3dbb342178ba26e3019fb87282023-11-22T21:11:41ZengMDPI AGMaterials1996-19442021-10-011421640510.3390/ma14216405Temperature Effects on the Compressive Behaviors of Closed-Cell Copper Foams Prepared by Powder MetallurgyBin Han0Yunyu Li1Zeyu Wang2Xi Gu3Qi Zhang4School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaSchool of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaSchool of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaSchool of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaSchool of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaA fabrication technology of closed-cell copper foams (CCCFs) based on powder metallurgy is proposed, by using the expanded polystyrene foams (EPS) spheres with the prescribed diameter as the space holder before sintering. The material characterization and the quasi-static compressive behaviors of both uniform and graded CCCFs at different temperatures were experimentally studied. A high temperature weakens the initial compressive modulus, plateau stress, and effective energy absorption for both uniform and graded CCCFs; meanwhile, the onset strain of densification and the maximum energy absorption efficiency are less sensitive to temperature, especially for the graded CCCFs. Compared with the uniform CCCF, the graded CCCF with even a small relative density exhibits superiority in terms of the effective energy absorption and the maximum energy absorption efficiency, attributed to the much larger onset strain of densification for the gradient pore arrangement. Finite element simulations based on the ideal sphere foam model can basically mimic the compressive performance of the CCCF samples. It is also found that both the decrease of pore diameter and the increase of cell wall thickness could improve the compressive performance of the CCCFs.https://www.mdpi.com/1996-1944/14/21/6405closed-cell copper foam (CCCF)graded poreuniform porehigh temperature
spellingShingle Bin Han
Yunyu Li
Zeyu Wang
Xi Gu
Qi Zhang
Temperature Effects on the Compressive Behaviors of Closed-Cell Copper Foams Prepared by Powder Metallurgy
Materials
closed-cell copper foam (CCCF)
graded pore
uniform pore
high temperature
title Temperature Effects on the Compressive Behaviors of Closed-Cell Copper Foams Prepared by Powder Metallurgy
title_full Temperature Effects on the Compressive Behaviors of Closed-Cell Copper Foams Prepared by Powder Metallurgy
title_fullStr Temperature Effects on the Compressive Behaviors of Closed-Cell Copper Foams Prepared by Powder Metallurgy
title_full_unstemmed Temperature Effects on the Compressive Behaviors of Closed-Cell Copper Foams Prepared by Powder Metallurgy
title_short Temperature Effects on the Compressive Behaviors of Closed-Cell Copper Foams Prepared by Powder Metallurgy
title_sort temperature effects on the compressive behaviors of closed cell copper foams prepared by powder metallurgy
topic closed-cell copper foam (CCCF)
graded pore
uniform pore
high temperature
url https://www.mdpi.com/1996-1944/14/21/6405
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AT zeyuwang temperatureeffectsonthecompressivebehaviorsofclosedcellcopperfoamspreparedbypowdermetallurgy
AT xigu temperatureeffectsonthecompressivebehaviorsofclosedcellcopperfoamspreparedbypowdermetallurgy
AT qizhang temperatureeffectsonthecompressivebehaviorsofclosedcellcopperfoamspreparedbypowdermetallurgy