High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method

A thermally grown oxide (TGO) layer usually generates at the interface between the ceramic coating and the bond coating during the long-term high temperature service. TGO creep can affect the service life of thermal barrier coatings. In this paper, a dense TGO layer with a thickness of 4 μm is forme...

Full description

Bibliographic Details
Main Authors: Y. Zou, J.W. Guo, Y.Q. Xiao, W. Zhu
Format: Article
Language:English
Published: Elsevier 2023-07-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423014382
_version_ 1797745213594140672
author Y. Zou
J.W. Guo
Y.Q. Xiao
W. Zhu
author_facet Y. Zou
J.W. Guo
Y.Q. Xiao
W. Zhu
author_sort Y. Zou
collection DOAJ
description A thermally grown oxide (TGO) layer usually generates at the interface between the ceramic coating and the bond coating during the long-term high temperature service. TGO creep can affect the service life of thermal barrier coatings. In this paper, a dense TGO layer with a thickness of 4 μm is formed on the surface of the PtAl bond coating. The high-temperature creep behavior of the TGO layer is investigated by tensile combined with a digital image correlation method. The creep mechanism of TGO at 750 °C–950 °C is dislocation creep (stress exponent ∼4, and creep activation energy of 706–815 kJ/mol). The creep strain rate of TGO at 750 °C–950 °C is in the range of 4.7 × 10−6 s−1–4.7 × 10−4 s−1. The failure behavior of the TGO layer is significantly affected by temperature and applied stress. As the temperature and stress increase, the surface vertical cracks initiate at the TGO surface and propagate to the interface of TGO/PtAl bond coating, leading to the delamination and cracking of TGO layer.
first_indexed 2024-03-12T15:20:09Z
format Article
id doaj.art-b4e9f68bc12e41588b99b3c535f7b144
institution Directory Open Access Journal
issn 2238-7854
language English
last_indexed 2024-03-12T15:20:09Z
publishDate 2023-07-01
publisher Elsevier
record_format Article
series Journal of Materials Research and Technology
spelling doaj.art-b4e9f68bc12e41588b99b3c535f7b1442023-08-11T05:33:51ZengElsevierJournal of Materials Research and Technology2238-78542023-07-012539573966High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation methodY. Zou0J.W. Guo1Y.Q. Xiao2W. Zhu3Key Laboratory of Key Film Materials & Application for Equipment (Hunan Province), School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan, 411105, ChinaKey Laboratory of Key Film Materials & Application for Equipment (Hunan Province), School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan, 411105, China; Corresponding author.Department of Mechanical Engineering, Hunan Institute of Engineering, Xiangtan, 411104, ChinaKey Laboratory of Key Film Materials & Application for Equipment (Hunan Province), School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan, 411105, China; Corresponding author.A thermally grown oxide (TGO) layer usually generates at the interface between the ceramic coating and the bond coating during the long-term high temperature service. TGO creep can affect the service life of thermal barrier coatings. In this paper, a dense TGO layer with a thickness of 4 μm is formed on the surface of the PtAl bond coating. The high-temperature creep behavior of the TGO layer is investigated by tensile combined with a digital image correlation method. The creep mechanism of TGO at 750 °C–950 °C is dislocation creep (stress exponent ∼4, and creep activation energy of 706–815 kJ/mol). The creep strain rate of TGO at 750 °C–950 °C is in the range of 4.7 × 10−6 s−1–4.7 × 10−4 s−1. The failure behavior of the TGO layer is significantly affected by temperature and applied stress. As the temperature and stress increase, the surface vertical cracks initiate at the TGO surface and propagate to the interface of TGO/PtAl bond coating, leading to the delamination and cracking of TGO layer.http://www.sciencedirect.com/science/article/pii/S2238785423014382Thermally grown oxideHigh temperature creepStress exponentCreep activation energyFailure analysis
spellingShingle Y. Zou
J.W. Guo
Y.Q. Xiao
W. Zhu
High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method
Journal of Materials Research and Technology
Thermally grown oxide
High temperature creep
Stress exponent
Creep activation energy
Failure analysis
title High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method
title_full High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method
title_fullStr High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method
title_full_unstemmed High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method
title_short High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method
title_sort high temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method
topic Thermally grown oxide
High temperature creep
Stress exponent
Creep activation energy
Failure analysis
url http://www.sciencedirect.com/science/article/pii/S2238785423014382
work_keys_str_mv AT yzou hightemperaturecreepstudyonthermallygrownoxidebytensilecombinedwithadigitalimagecorrelationmethod
AT jwguo hightemperaturecreepstudyonthermallygrownoxidebytensilecombinedwithadigitalimagecorrelationmethod
AT yqxiao hightemperaturecreepstudyonthermallygrownoxidebytensilecombinedwithadigitalimagecorrelationmethod
AT wzhu hightemperaturecreepstudyonthermallygrownoxidebytensilecombinedwithadigitalimagecorrelationmethod