Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis

In this paper, the design and the thermal analysis of a tribled microprocessor cooler combining the advantages of strong swirl flow and minichannel-fins and CuO nanofluid, have been presented. It is thought that the results will contribute to the understanding of the effects of parameters on the coo...

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Main Author: Arzutuğ Mehmet Emin
Format: Article
Language:English
Published: Sciendo 2023-09-01
Series:Polish Journal of Chemical Technology
Subjects:
Online Access:https://doi.org/10.2478/pjct-2023-0029
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author Arzutuğ Mehmet Emin
author_facet Arzutuğ Mehmet Emin
author_sort Arzutuğ Mehmet Emin
collection DOAJ
description In this paper, the design and the thermal analysis of a tribled microprocessor cooler combining the advantages of strong swirl flow and minichannel-fins and CuO nanofluid, have been presented. It is thought that the results will contribute to the understanding of the effects of parameters on the cooling flux of the heat sink and the decline at the microprocessor temperature, as Reynolds number in the minichannels and CuO % volume fraction. The results have exhibited that the total performance of the heat sink cooled with the mixture of water–CuO-EG nanofluids increases with the increase of Re number and the %load of nanoparticles in the coolant. It has been determined that the energy withdrawn from the microprocessor was 241 times higher than the energy generated for maximum CuO load and Re number conditions. Besides, the highest temperature decrease has been measured at the maximum CuO load value and maximum Re number.
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spelling doaj.art-b50d9cd00091495587c12f290f5652012023-10-16T06:07:53ZengSciendoPolish Journal of Chemical Technology1899-47412023-09-012538910010.2478/pjct-2023-0029Design of a CPU Heat Sink with Minichannel-Fins & its Thermal AnalysisArzutuğ Mehmet Emin01Atatürk University, Engineering Faculty, Chemical Eng. Department, Office UZ117, TR-25100 Erzurum, TÜRKİYE Ener-KA, Ata Teknokent, TR-25240 Erzurum, TürkiyeIn this paper, the design and the thermal analysis of a tribled microprocessor cooler combining the advantages of strong swirl flow and minichannel-fins and CuO nanofluid, have been presented. It is thought that the results will contribute to the understanding of the effects of parameters on the cooling flux of the heat sink and the decline at the microprocessor temperature, as Reynolds number in the minichannels and CuO % volume fraction. The results have exhibited that the total performance of the heat sink cooled with the mixture of water–CuO-EG nanofluids increases with the increase of Re number and the %load of nanoparticles in the coolant. It has been determined that the energy withdrawn from the microprocessor was 241 times higher than the energy generated for maximum CuO load and Re number conditions. Besides, the highest temperature decrease has been measured at the maximum CuO load value and maximum Re number.https://doi.org/10.2478/pjct-2023-0029cpuheat sinkcoolingnano fluidfin
spellingShingle Arzutuğ Mehmet Emin
Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis
Polish Journal of Chemical Technology
cpu
heat sink
cooling
nano fluid
fin
title Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis
title_full Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis
title_fullStr Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis
title_full_unstemmed Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis
title_short Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis
title_sort design of a cpu heat sink with minichannel fins its thermal analysis
topic cpu
heat sink
cooling
nano fluid
fin
url https://doi.org/10.2478/pjct-2023-0029
work_keys_str_mv AT arzutugmehmetemin designofacpuheatsinkwithminichannelfinsitsthermalanalysis