APA引文

Liu, D., Chen, P., Chou, T., Hu, H., & Chen, K. (2021). Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE.

芝加哥风格引文

Liu, Demin, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, 与 Kuan-Neng Chen. Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE, 2021.

MLA引文

Liu, Demin, et al. Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE, 2021.