APA(7版)引用形式

Liu, D., Chen, P., Chou, T., Hu, H., & Chen, K. (2021). Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE.

Chicagoスタイル(17版)引用形式

Liu, Demin, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, , Kuan-Neng Chen. Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE, 2021.

MLA(9版)引用形式

Liu, Demin, et al. Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE, 2021.