Liu, D., Chen, P., Chou, T., Hu, H., & Chen, K. (2021). Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE.
Chicago-referens (17:e uppl.)Liu, Demin, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, och Kuan-Neng Chen. Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE, 2021.
MLA-referens (9:e uppl.)Liu, Demin, et al. Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation. IEEE, 2021.
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