A general White–Box strategy for designing thermoelectric cooling system
Abstract Thermoelectric cooling (TEC) is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation. The formulae for efficiency in standard textbooks can only describe the performance of a TEC module with ideal thermal conditions, that is,...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2022-11-01
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| Series: | InfoMat |
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| Online Access: | https://doi.org/10.1002/inf2.12324 |
| _version_ | 1811319554531393536 |
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| author | Kang Zhu Biao Deng Xin Qian Yupeng Wang Huan Li Peng Jiang Ronggui Yang Weishu Liu |
| author_facet | Kang Zhu Biao Deng Xin Qian Yupeng Wang Huan Li Peng Jiang Ronggui Yang Weishu Liu |
| author_sort | Kang Zhu |
| collection | DOAJ |
| description | Abstract Thermoelectric cooling (TEC) is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation. The formulae for efficiency in standard textbooks can only describe the performance of a TEC module with ideal thermal conditions, that is, fixed terminal temperatures, but are unable to deal with a real TEC system where heat transfer at its interfaces with the heat source and sink are finite and with thermal resistances. Here, we define the TEC system‐level performance indices, that is, the maximum cooling power, temperature difference, and coefficient of performance, by introducing a set of explicit formulae. The external heat transfer conditions are taken into account as dimensionless thermal resistance parameters. With these formulae, the TEC system performances are evaluated elegantly with errors well within ±5% over broad operating conditions. We further optimize the cooling power and the coefficient of performance in practical scenarios and establish a general White–Box design procedure for TEC systems, which enables a transparent design process and straightforward analysis of performance bottlenecks. A set of cooling experiments are performed to validate the analytical model and to illustrate the dependence of system design on realistic thermal conditions. By choosing the suitable TEC module parameter under given external heat transfer conditions, the cooling power can be improved by more than 100%. This work sheds some light on the integral design of TEC systems for broad applications to take full advantage of the advanced thermoelectric materials in the cooling field. |
| first_indexed | 2024-04-13T12:43:59Z |
| format | Article |
| id | doaj.art-b5c29cbb99f844ab85eea5406c94ea03 |
| institution | Directory Open Access Journal |
| issn | 2567-3165 |
| language | English |
| last_indexed | 2024-04-13T12:43:59Z |
| publishDate | 2022-11-01 |
| publisher | Wiley |
| record_format | Article |
| series | InfoMat |
| spelling | doaj.art-b5c29cbb99f844ab85eea5406c94ea032022-12-22T02:46:25ZengWileyInfoMat2567-31652022-11-01411n/an/a10.1002/inf2.12324A general White–Box strategy for designing thermoelectric cooling systemKang Zhu0Biao Deng1Xin Qian2Yupeng Wang3Huan Li4Peng Jiang5Ronggui Yang6Weishu Liu7Department of Materials Science and Engineering Southern University of Science and Technology Shenzhen Guangdong ChinaDepartment of Materials Science and Engineering Southern University of Science and Technology Shenzhen Guangdong ChinaSchool of Energy and Power Engineering Huazhong University of Science and Technology Wuhan Hubei ChinaDepartment of Materials Science and Engineering Southern University of Science and Technology Shenzhen Guangdong ChinaDepartment of Materials Science and Engineering Southern University of Science and Technology Shenzhen Guangdong ChinaState Key Laboratory of Catalysis, CAS Center for Excellence in Nanoscience Dalian Institute of Chemical Physics, Chinese Academy of Sciences Dalian Liaoning ChinaSchool of Energy and Power Engineering Huazhong University of Science and Technology Wuhan Hubei ChinaDepartment of Materials Science and Engineering Southern University of Science and Technology Shenzhen Guangdong ChinaAbstract Thermoelectric cooling (TEC) is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation. The formulae for efficiency in standard textbooks can only describe the performance of a TEC module with ideal thermal conditions, that is, fixed terminal temperatures, but are unable to deal with a real TEC system where heat transfer at its interfaces with the heat source and sink are finite and with thermal resistances. Here, we define the TEC system‐level performance indices, that is, the maximum cooling power, temperature difference, and coefficient of performance, by introducing a set of explicit formulae. The external heat transfer conditions are taken into account as dimensionless thermal resistance parameters. With these formulae, the TEC system performances are evaluated elegantly with errors well within ±5% over broad operating conditions. We further optimize the cooling power and the coefficient of performance in practical scenarios and establish a general White–Box design procedure for TEC systems, which enables a transparent design process and straightforward analysis of performance bottlenecks. A set of cooling experiments are performed to validate the analytical model and to illustrate the dependence of system design on realistic thermal conditions. By choosing the suitable TEC module parameter under given external heat transfer conditions, the cooling power can be improved by more than 100%. This work sheds some light on the integral design of TEC systems for broad applications to take full advantage of the advanced thermoelectric materials in the cooling field.https://doi.org/10.1002/inf2.12324system‐level performancethermoelectric coolingWhite–Box design |
| spellingShingle | Kang Zhu Biao Deng Xin Qian Yupeng Wang Huan Li Peng Jiang Ronggui Yang Weishu Liu A general White–Box strategy for designing thermoelectric cooling system InfoMat system‐level performance thermoelectric cooling White–Box design |
| title | A general White–Box strategy for designing thermoelectric cooling system |
| title_full | A general White–Box strategy for designing thermoelectric cooling system |
| title_fullStr | A general White–Box strategy for designing thermoelectric cooling system |
| title_full_unstemmed | A general White–Box strategy for designing thermoelectric cooling system |
| title_short | A general White–Box strategy for designing thermoelectric cooling system |
| title_sort | general white box strategy for designing thermoelectric cooling system |
| topic | system‐level performance thermoelectric cooling White–Box design |
| url | https://doi.org/10.1002/inf2.12324 |
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