| Summary: | To meet the packaging requirements of terahertz (THz) communication systems, a microstrip line (MSL) to rectangular waveguide (RWG) transition is proposed in this paper. In the transition, the MSL is connected to the corrugated substrate integrated waveguide (CSIW) by a tapered MSL for quasi-TEM to TE<sub>10</sub>-like mode conversion on substrate, which requires no via holes or shaped dielectric, and is easy to process in THz bands. Then, the CSIW is straightly connected to the RWG transformer and converted to standard RWG, resulting in a compact structure. The working principle of the proposed transition is analyzed, and the influence of several important parameters on the <i>S</i>-parameters of the transition is discussed. A single transition is designed for the 325–500 GHz operation, the <i>S</i><sub>11</sub> better than −14.5 dB and <i>S</i><sub>21</sub> better than −1.03 dB have been achieved in the entire frequency band.
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