Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration
This paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-09-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/22/17/6696 |
| _version_ | 1797493054389616640 |
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| author | Weihua Yu Abbas Vosoogh Bowu Wang Zhongxia Simon He |
| author_facet | Weihua Yu Abbas Vosoogh Bowu Wang Zhongxia Simon He |
| author_sort | Weihua Yu |
| collection | DOAJ |
| description | This paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation behavior by using a cost-effective EBG hole configuration for millimeter-wave- and terahertz (THz)-frequency-band applications. Moreover, the mixer MMIC is connected to the proposed hollow rectangular waveguide line via a novel wire-bond wideband transition without using any intermediate substrate. A simple periodical nail structure is utilized to suppress the unwanted modes in the transition. Additionally, the presented solution does not impose any limitations on the chip’s dimensions or shape. The packaged mixer module shows a return loss lower than 10 dB for LO (70–85 GHz) and RF (150–170 GHz) ports, achieving a better performance than that of traditional waveguide transitions. The module could be used as a transmitter or receiver, and the conversion loss shows good agreement in multiple samples. The proposed packaging solution has the advantages of satisfactory frequency performance, broadband adaptability, low production costs, and excellent repeatability for millimeter-wave- and THz-band systems, which would facilitate the commercialization of millimeter-wave and THz products. |
| first_indexed | 2024-03-10T01:14:29Z |
| format | Article |
| id | doaj.art-b75612fd00ac429481675c24cdb625a7 |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-03-10T01:14:29Z |
| publishDate | 2022-09-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-b75612fd00ac429481675c24cdb625a72023-11-23T14:12:56ZengMDPI AGSensors1424-82202022-09-012217669610.3390/s22176696Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole ConfigurationWeihua Yu0Abbas Vosoogh1Bowu Wang2Zhongxia Simon He3Beijing Key Laboratory of Millimeter-Wave and Terahertz Wave Technology, School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, ChinaMicrowave Electronics Laboratory, Department of Microtechnology and Nanosciense (MC2), Chalmers University of Technology, SE-41296 Gothenburg, SwedenBeijing Key Laboratory of Millimeter-Wave and Terahertz Wave Technology, School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, ChinaMicrowave Electronics Laboratory, Department of Microtechnology and Nanosciense (MC2), Chalmers University of Technology, SE-41296 Gothenburg, SwedenThis paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation behavior by using a cost-effective EBG hole configuration for millimeter-wave- and terahertz (THz)-frequency-band applications. Moreover, the mixer MMIC is connected to the proposed hollow rectangular waveguide line via a novel wire-bond wideband transition without using any intermediate substrate. A simple periodical nail structure is utilized to suppress the unwanted modes in the transition. Additionally, the presented solution does not impose any limitations on the chip’s dimensions or shape. The packaged mixer module shows a return loss lower than 10 dB for LO (70–85 GHz) and RF (150–170 GHz) ports, achieving a better performance than that of traditional waveguide transitions. The module could be used as a transmitter or receiver, and the conversion loss shows good agreement in multiple samples. The proposed packaging solution has the advantages of satisfactory frequency performance, broadband adaptability, low production costs, and excellent repeatability for millimeter-wave- and THz-band systems, which would facilitate the commercialization of millimeter-wave and THz products.https://www.mdpi.com/1424-8220/22/17/6696electromagnetic band gap (EBG)mixerpackagingMMIC to waveguidetransition |
| spellingShingle | Weihua Yu Abbas Vosoogh Bowu Wang Zhongxia Simon He Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration Sensors electromagnetic band gap (EBG) mixer packaging MMIC to waveguide transition |
| title | Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration |
| title_full | Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration |
| title_fullStr | Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration |
| title_full_unstemmed | Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration |
| title_short | Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration |
| title_sort | substrateless packaging for a d band mmic based on a waveguide with a glide symmetric ebg hole configuration |
| topic | electromagnetic band gap (EBG) mixer packaging MMIC to waveguide transition |
| url | https://www.mdpi.com/1424-8220/22/17/6696 |
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