Research of Vertical via Based on Silicon, Ceramic and Glass
With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as the fourth-generation packaging technology beyond Mo...
| Hlavní autoři: | , , |
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| Médium: | Článek |
| Jazyk: | English |
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MDPI AG
2023-07-01
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| Edice: | Micromachines |
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| On-line přístup: | https://www.mdpi.com/2072-666X/14/7/1391 |