4H-SiC-Based ESD Protection Design With Optimization of Segmented LIGBT for High-Voltage Applications

4H-SiC is a wide-bandgap material that exhibits excellent high-temperature conductivity and high operating voltage. These characteristics can provide high electrostatic discharge (ESD) robustness in high voltage applications. However, a considerably wide range of snapback phenomena is triggered for...

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Main Authors: Kyoung-Il Do, Seung-Hoo Jin, Byung-Seok Lee, Yong-Seo Koo
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9580467/
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author Kyoung-Il Do
Seung-Hoo Jin
Byung-Seok Lee
Yong-Seo Koo
author_facet Kyoung-Il Do
Seung-Hoo Jin
Byung-Seok Lee
Yong-Seo Koo
author_sort Kyoung-Il Do
collection DOAJ
description 4H-SiC is a wide-bandgap material that exhibits excellent high-temperature conductivity and high operating voltage. These characteristics can provide high electrostatic discharge (ESD) robustness in high voltage applications. However, a considerably wide range of snapback phenomena is triggered for 4H-SiC-based ESD protection devices owing to a high critical electric field. In this study, an ESD protection device based on a lateral insulated-gate bipolar transistor (LIGBT) with a new structure that creates an internal silicon-controlled rectifier (SCR) path is proposed. The proposed ESD protection device minimizes the effective base region of the NPN parasitic bipolar transistor to the gate length based on the internal SCR operation of the LIGBT. It also adjusts the emitter injection efficiency of the PNP parasitic bipolar transistor by introducing a segment topology and inserting an additional implant area. Consequently, the proposed ESD protection device significantly improves the wide range of snapback phenomena occurring in the 4H-SiC materials. A conventional SCR, the LIGBT, and the proposed protection device were fabricated using the 4H-SiC process under the same condition, and their electrical characteristics were comparatively analyzed using a transmission-line pulse system. Moreover, its high-temperature reliability was evaluated at 300–500 K to examine the compatibility with 4H-SiC devices and circuits that require a relatively high-temperature operation.
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spelling doaj.art-b9a17cd5689e4ec3a2c12905a3b44c7a2022-12-21T20:46:14ZengIEEEIEEE Journal of the Electron Devices Society2168-67342021-01-0191017102310.1109/JEDS.2021.312121295804674H-SiC-Based ESD Protection Design With Optimization of Segmented LIGBT for High-Voltage ApplicationsKyoung-Il Do0https://orcid.org/0000-0001-8440-9767Seung-Hoo Jin1Byung-Seok Lee2Yong-Seo Koo3Department of Electronics and Electrical Engineering, Dankook University, Yongin, Republic of KoreaDepartment of Electronics and Electrical Engineering, Dankook University, Yongin, Republic of KoreaDepartment of Electronics and Electrical Engineering, Dankook University, Yongin, Republic of KoreaDepartment of Electronics and Electrical Engineering, Dankook University, Yongin, Republic of Korea4H-SiC is a wide-bandgap material that exhibits excellent high-temperature conductivity and high operating voltage. These characteristics can provide high electrostatic discharge (ESD) robustness in high voltage applications. However, a considerably wide range of snapback phenomena is triggered for 4H-SiC-based ESD protection devices owing to a high critical electric field. In this study, an ESD protection device based on a lateral insulated-gate bipolar transistor (LIGBT) with a new structure that creates an internal silicon-controlled rectifier (SCR) path is proposed. The proposed ESD protection device minimizes the effective base region of the NPN parasitic bipolar transistor to the gate length based on the internal SCR operation of the LIGBT. It also adjusts the emitter injection efficiency of the PNP parasitic bipolar transistor by introducing a segment topology and inserting an additional implant area. Consequently, the proposed ESD protection device significantly improves the wide range of snapback phenomena occurring in the 4H-SiC materials. A conventional SCR, the LIGBT, and the proposed protection device were fabricated using the 4H-SiC process under the same condition, and their electrical characteristics were comparatively analyzed using a transmission-line pulse system. Moreover, its high-temperature reliability was evaluated at 300–500 K to examine the compatibility with 4H-SiC devices and circuits that require a relatively high-temperature operation.https://ieeexplore.ieee.org/document/9580467/Electrostatic dischargeholding voltagesnapbacksilicon-controlled rectifierlateral insulated-gate bipolar transistor
spellingShingle Kyoung-Il Do
Seung-Hoo Jin
Byung-Seok Lee
Yong-Seo Koo
4H-SiC-Based ESD Protection Design With Optimization of Segmented LIGBT for High-Voltage Applications
IEEE Journal of the Electron Devices Society
Electrostatic discharge
holding voltage
snapback
silicon-controlled rectifier
lateral insulated-gate bipolar transistor
title 4H-SiC-Based ESD Protection Design With Optimization of Segmented LIGBT for High-Voltage Applications
title_full 4H-SiC-Based ESD Protection Design With Optimization of Segmented LIGBT for High-Voltage Applications
title_fullStr 4H-SiC-Based ESD Protection Design With Optimization of Segmented LIGBT for High-Voltage Applications
title_full_unstemmed 4H-SiC-Based ESD Protection Design With Optimization of Segmented LIGBT for High-Voltage Applications
title_short 4H-SiC-Based ESD Protection Design With Optimization of Segmented LIGBT for High-Voltage Applications
title_sort 4h sic based esd protection design with optimization of segmented ligbt for high voltage applications
topic Electrostatic discharge
holding voltage
snapback
silicon-controlled rectifier
lateral insulated-gate bipolar transistor
url https://ieeexplore.ieee.org/document/9580467/
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AT yongseokoo 4hsicbasedesdprotectiondesignwithoptimizationofsegmentedligbtforhighvoltageapplications