Development Strategy for Advanced Copper-Based Materials in China
Copper and copper-based materials are widely applied to power electronics, automobile, and mechanical manufacturing as well as to high-tech manufacturing fields such as aeronautics, astronautics, telecommunications, and integrated circuits owing to their comprehensive advantages in mechanical, funct...
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| Format: | Article |
| Language: | zho |
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《中国工程科学》杂志社
2023-02-01
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| Series: | 中国工程科学 |
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| Online Access: | http://www.engineering.org.cn/en/10.15302/J-SSCAE-2023.01.006 |
| _version_ | 1797628190389174272 |
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| author | Mi Xujun Lou Huafen Xie Haofeng Mo Yongda Zhang Wenjing Xiang Chaojian |
| author_facet | Mi Xujun Lou Huafen Xie Haofeng Mo Yongda Zhang Wenjing Xiang Chaojian |
| author_sort | Mi Xujun |
| collection | DOAJ |
| description | Copper and copper-based materials are widely applied to power electronics, automobile, and mechanical manufacturing as well as to high-tech manufacturing fields such as aeronautics, astronautics, telecommunications, and integrated circuits owing to their comprehensive advantages in mechanical, functional, and processing properties. As China is the greatest producer and consumer of milled copper products in the world, advanced copper-based materials are envisioned with a bright prospect in China owing to a vast Chinese market. Starting from a general description of the macrostructure and status quo of China’s copper milling industry, the strengths and weaknesses of material-related development are analyzed. The development status, existing problems, and future development trend of high-strength conductive copper alloy, high-performance electronic copper foils, wear- and corrosion-resistant copper alloys, copper-based thermal management materials, and copper materials for special purposes and new energy in China are emphatically reviewed. Development ideas and suggestions are proposed including laying out frontier directions for major application needs, forming an effective interaction mechanism among production, education, research, and application, and establishing a national industrial and technological development coordination platform for copper-based materials.
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| first_indexed | 2024-03-11T10:34:55Z |
| format | Article |
| id | doaj.art-b9a33756121241e8a4d658d1eb65555a |
| institution | Directory Open Access Journal |
| issn | 2096-0034 |
| language | zho |
| last_indexed | 2024-03-11T10:34:55Z |
| publishDate | 2023-02-01 |
| publisher | 《中国工程科学》杂志社 |
| record_format | Article |
| series | 中国工程科学 |
| spelling | doaj.art-b9a33756121241e8a4d658d1eb65555a2023-11-14T11:26:26Zzho《中国工程科学》杂志社中国工程科学2096-00342023-02-012519610310.15302/J-SSCAE-2023.01.006Development Strategy for Advanced Copper-Based Materials in ChinaMi Xujun 0 Lou Huafen 1 Xie Haofeng 2 Mo Yongda3 Zhang Wenjing 4 Xiang Chaojian 5 State Key Laboratory of Nonferrous Metals and Processes, China GRINM Group Co., Ltd., Beijing 100088, China ; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China Chinalco Research Institute of Science and Technology Co., Ltd., Beijing 102209, China ; China Copper Institute of Engineering and Technology, Beijing 102209, China State Key Laboratory of Nonferrous Metals and Processes, China GRINM Group Co., Ltd., Beijing 100088, China ; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China China Copper Institute of Engineering and Technology, Beijing 102209, China State Key Laboratory of Nonferrous Metals and Processes, China GRINM Group Co., Ltd., Beijing 100088, China ; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China China Copper Institute of Engineering and Technology, Beijing 102209, China Copper and copper-based materials are widely applied to power electronics, automobile, and mechanical manufacturing as well as to high-tech manufacturing fields such as aeronautics, astronautics, telecommunications, and integrated circuits owing to their comprehensive advantages in mechanical, functional, and processing properties. As China is the greatest producer and consumer of milled copper products in the world, advanced copper-based materials are envisioned with a bright prospect in China owing to a vast Chinese market. Starting from a general description of the macrostructure and status quo of China’s copper milling industry, the strengths and weaknesses of material-related development are analyzed. The development status, existing problems, and future development trend of high-strength conductive copper alloy, high-performance electronic copper foils, wear- and corrosion-resistant copper alloys, copper-based thermal management materials, and copper materials for special purposes and new energy in China are emphatically reviewed. Development ideas and suggestions are proposed including laying out frontier directions for major application needs, forming an effective interaction mechanism among production, education, research, and application, and establishing a national industrial and technological development coordination platform for copper-based materials. http://www.engineering.org.cn/en/10.15302/J-SSCAE-2023.01.006advanced copper-based materials functional characteristic high-tech manufacturing copper milling industry |
| spellingShingle | Mi Xujun Lou Huafen Xie Haofeng Mo Yongda Zhang Wenjing Xiang Chaojian Development Strategy for Advanced Copper-Based Materials in China 中国工程科学 advanced copper-based materials functional characteristic high-tech manufacturing copper milling industry |
| title | Development Strategy for Advanced Copper-Based Materials in China |
| title_full | Development Strategy for Advanced Copper-Based Materials in China |
| title_fullStr | Development Strategy for Advanced Copper-Based Materials in China |
| title_full_unstemmed | Development Strategy for Advanced Copper-Based Materials in China |
| title_short | Development Strategy for Advanced Copper-Based Materials in China |
| title_sort | development strategy for advanced copper based materials in china |
| topic | advanced copper-based materials functional characteristic high-tech manufacturing copper milling industry |
| url | http://www.engineering.org.cn/en/10.15302/J-SSCAE-2023.01.006 |
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