Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology
This paper introduces a novel approach to address thermal management challenges in system-in-package (SiP) technology, which is a significant concern in various advanced technologies. The main objective is to assess the electrical and thermal performance of the SiP model by utilizing Chip Cooling La...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-07-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/12/14/3154 |