| Summary: | Abstract: Convective heating and cooling of the surfaces find application in process industry. During the heating or cooling cycle of the process, thermodynamic irreversibility which can be associated with the process parameters occurs. Moreover, thermodynamic irreversibility associated with the heating cycle can be quantified through entropy analysis. In the present study, convective heating of the solid surface is considered. A mathematical formulation of the temperature rise and thermal stress development during the transient heating process is presented. Entropy generation due to temperature field and thermal displacement is also formulated. The simulation for temperature rise, thermal displacement, and entropy generation are carried out for steel substrate. It is found that thermal displacement does not exactly follow the temperature distribution inside the substrate material. The magnitude of entropy generation due to temperature field is considerably higher than that corresponding to the thermal displacement.
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