CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING
Cooling of Electronic equipment’s is an attractiveresearch area in engineering applications. Continuedminimization of electronic system has resulted in dramaticincrease in the amount of heat generated per unit volume, Theaim of this study is to use computational Fluid Dynamics inorder to draw a CFD...
Main Authors: | , , , |
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Format: | Article |
Language: | Arabic |
Published: |
Faculty of engineering, Tanta University
2019-03-01
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Series: | Journal of Engineering Research - Egypt |
Online Access: | https://erjeng.journals.ekb.eg/article_125474_edf5ea2a455d17e31df44e5dc4799c87.pdf |
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author | A. Kabeel A. A.Khalil, M. El-Hadary G. Sultan |
author_facet | A. Kabeel A. A.Khalil, M. El-Hadary G. Sultan |
author_sort | A. Kabeel |
collection | DOAJ |
description | Cooling of Electronic equipment’s is an attractiveresearch area in engineering applications. Continuedminimization of electronic system has resulted in dramaticincrease in the amount of heat generated per unit volume, Theaim of this study is to use computational Fluid Dynamics inorder to draw a CFD model for forced cooling conjugate heattransfer analyses in heat generating electronic systems andcompare between a collection of actual commercial heat sinksdifferent from in geometry ,material , and number of fins .Acomplete computer chassis model with heat sinks and fansinside was created and parametric analyses were performed tocompare the effects of different turbulence models, meshresolutions, and radiative heat transfer. The CFD software wasused, ANSYS Icepack 18.0 for preprocessing and fluent forsolution and post processing. The road map was applied to fivedifferent heat sinks and another three heat sink as a validationmodeled into the full chassis. Numerical results were comparedwith the available experimental data and they were in goodagreement. |
first_indexed | 2024-03-13T04:14:56Z |
format | Article |
id | doaj.art-bc9759d991a24681bf58a39b6819973e |
institution | Directory Open Access Journal |
issn | 2356-9441 2735-4873 |
language | Arabic |
last_indexed | 2024-03-13T04:14:56Z |
publishDate | 2019-03-01 |
publisher | Faculty of engineering, Tanta University |
record_format | Article |
series | Journal of Engineering Research - Egypt |
spelling | doaj.art-bc9759d991a24681bf58a39b6819973e2023-06-21T06:49:14ZaraFaculty of engineering, Tanta UniversityJournal of Engineering Research - Egypt2356-94412735-48732019-03-013March202910.21608/erjeng.2019.125474125474CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLINGA. Kabeel0A. A.Khalil,1M. El-Hadary2G. Sultan3Tanta University, Mechanical Engineering Department, EgyptTanta University, Mechanical Engineering Department, EgyptTanta University, Mechanical Engineering Department, EgyptMansoura University, Mechanical Engineering Department, EgyptCooling of Electronic equipment’s is an attractiveresearch area in engineering applications. Continuedminimization of electronic system has resulted in dramaticincrease in the amount of heat generated per unit volume, Theaim of this study is to use computational Fluid Dynamics inorder to draw a CFD model for forced cooling conjugate heattransfer analyses in heat generating electronic systems andcompare between a collection of actual commercial heat sinksdifferent from in geometry ,material , and number of fins .Acomplete computer chassis model with heat sinks and fansinside was created and parametric analyses were performed tocompare the effects of different turbulence models, meshresolutions, and radiative heat transfer. The CFD software wasused, ANSYS Icepack 18.0 for preprocessing and fluent forsolution and post processing. The road map was applied to fivedifferent heat sinks and another three heat sink as a validationmodeled into the full chassis. Numerical results were comparedwith the available experimental data and they were in goodagreement.https://erjeng.journals.ekb.eg/article_125474_edf5ea2a455d17e31df44e5dc4799c87.pdf |
spellingShingle | A. Kabeel A. A.Khalil, M. El-Hadary G. Sultan CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING Journal of Engineering Research - Egypt |
title | CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING |
title_full | CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING |
title_fullStr | CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING |
title_full_unstemmed | CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING |
title_short | CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING |
title_sort | cfd study of using different heat sinks for electronic equipments cooling |
url | https://erjeng.journals.ekb.eg/article_125474_edf5ea2a455d17e31df44e5dc4799c87.pdf |
work_keys_str_mv | AT akabeel cfdstudyofusingdifferentheatsinksforelectronicequipmentscooling AT aakhalil cfdstudyofusingdifferentheatsinksforelectronicequipmentscooling AT melhadary cfdstudyofusingdifferentheatsinksforelectronicequipmentscooling AT gsultan cfdstudyofusingdifferentheatsinksforelectronicequipmentscooling |