Mathematical Modeling of Temperature Field of Multilayer Enclosure Structures
The mathematical model of heat exchange process through multilayer enclosure structure is constructed. Herein infiltration and heat-conducting inclusions are taken into account. Heat exchange process modeling in the stationary and non- stationary conditions is considered.The method of temperature fi...
Main Authors: | , , , , |
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Format: | Article |
Language: | English |
Published: |
EDP Sciences
2016-01-01
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Series: | MATEC Web of Conferences |
Online Access: | http://dx.doi.org/10.1051/matecconf/20167302023 |
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author | Aksenov Boris Karyakina Svetlana Stepanov Oleg Shapoval Anatoly Bodrov Mikhail |
author_facet | Aksenov Boris Karyakina Svetlana Stepanov Oleg Shapoval Anatoly Bodrov Mikhail |
author_sort | Aksenov Boris |
collection | DOAJ |
description | The mathematical model of heat exchange process through multilayer enclosure structure is constructed. Herein infiltration and heat-conducting inclusions are taken into account. Heat exchange process modeling in the stationary and non- stationary conditions is considered.The method of temperature field constructing based on the suggested model is offered. The three-dimensional boundary problem of non- stationary heat conductivity is solved numerically using the implicit method of alternating directions. The temperature field constructing of the enclosure structures in the non- stationary condition allows to track dynamics of thermal flows through enclosing structures and to receive the thermal resistance considering influence of heat-conducting inclusions. |
first_indexed | 2024-12-13T15:20:32Z |
format | Article |
id | doaj.art-bca18bba6e314f9eb2af1d512ed23f9c |
institution | Directory Open Access Journal |
issn | 2261-236X |
language | English |
last_indexed | 2024-12-13T15:20:32Z |
publishDate | 2016-01-01 |
publisher | EDP Sciences |
record_format | Article |
series | MATEC Web of Conferences |
spelling | doaj.art-bca18bba6e314f9eb2af1d512ed23f9c2022-12-21T23:40:34ZengEDP SciencesMATEC Web of Conferences2261-236X2016-01-01730202310.1051/matecconf/20167302023matecconf_tpacee2016_02023Mathematical Modeling of Temperature Field of Multilayer Enclosure StructuresAksenov Boris0Karyakina Svetlana1Stepanov Oleg2Shapoval Anatoly3Bodrov Mikhail4Industrial University of TyumenIndustrial University of TyumenIndustrial University of TyumenIndustrial University of TyumenNizhny Novgorod State University of Architecture and Civil EngineeringThe mathematical model of heat exchange process through multilayer enclosure structure is constructed. Herein infiltration and heat-conducting inclusions are taken into account. Heat exchange process modeling in the stationary and non- stationary conditions is considered.The method of temperature field constructing based on the suggested model is offered. The three-dimensional boundary problem of non- stationary heat conductivity is solved numerically using the implicit method of alternating directions. The temperature field constructing of the enclosure structures in the non- stationary condition allows to track dynamics of thermal flows through enclosing structures and to receive the thermal resistance considering influence of heat-conducting inclusions.http://dx.doi.org/10.1051/matecconf/20167302023 |
spellingShingle | Aksenov Boris Karyakina Svetlana Stepanov Oleg Shapoval Anatoly Bodrov Mikhail Mathematical Modeling of Temperature Field of Multilayer Enclosure Structures MATEC Web of Conferences |
title | Mathematical Modeling of Temperature Field of Multilayer Enclosure Structures |
title_full | Mathematical Modeling of Temperature Field of Multilayer Enclosure Structures |
title_fullStr | Mathematical Modeling of Temperature Field of Multilayer Enclosure Structures |
title_full_unstemmed | Mathematical Modeling of Temperature Field of Multilayer Enclosure Structures |
title_short | Mathematical Modeling of Temperature Field of Multilayer Enclosure Structures |
title_sort | mathematical modeling of temperature field of multilayer enclosure structures |
url | http://dx.doi.org/10.1051/matecconf/20167302023 |
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