Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst
Improvements in the performance of electronic devices necessitate the development of polymer materials with heat dissipation properties. Liquid crystalline (LC) epoxies have attracted attention because of the orientation of their polymer network chains and their resultant high thermal conductivity....
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MDPI AG
2023-12-01
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| Online Access: | https://www.mdpi.com/2073-4352/14/1/47 |
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| author | Miyuki Harada Takuya Matsumoto |
| author_facet | Miyuki Harada Takuya Matsumoto |
| author_sort | Miyuki Harada |
| collection | DOAJ |
| description | Improvements in the performance of electronic devices necessitate the development of polymer materials with heat dissipation properties. Liquid crystalline (LC) epoxies have attracted attention because of the orientation of their polymer network chains and their resultant high thermal conductivity. In this study, a diglycidyl ether of 1-methyl-3-(4-phenylcyclohex-1-enyl)benzene was successfully synthesized as an LC epoxy and the LC temperature range was evaluated via differential scanning calorimeter (DSC). The synthesized LC epoxy was cured with <i>m</i>-phenylenediamine (<i>m</i>-PDA) as an amine-type curing agent and 1-(2-cyanoethyl)-2-undecylimidazole (CEUI) as a latent curing catalyst, respectively. The LC phase structure and domain size of the resultant epoxy thermosets were analyzed through X-ray diffraction (XRD) and polarized optical microscopy (POM). High thermal conductivity was observed in the <i>m</i>-PDA system (0.31 W/(m·K)) compared to the CEUI system (0.27 W/(m·K)). On the other hand, in composites loaded with 55 vol% Al<sub>2</sub>O<sub>3</sub> particles as a thermal conductive filler, the CEUI composites showed a higher thermal conductivity value of 2.47 W/(m·K) than the <i>m</i>-PDA composites (1.70 W/(m·K)). This difference was attributed to the LC orientation of the epoxy matrix, induced by the hydroxyl groups on the alumina surface and the latent curing reaction. |
| first_indexed | 2024-03-08T09:56:08Z |
| format | Article |
| id | doaj.art-bcb1939b8f72495881954127c2093a0d |
| institution | Directory Open Access Journal |
| issn | 2073-4352 |
| language | English |
| last_indexed | 2024-03-08T09:56:08Z |
| publishDate | 2023-12-01 |
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| spelling | doaj.art-bcb1939b8f72495881954127c2093a0d2024-01-29T13:51:13ZengMDPI AGCrystals2073-43522023-12-011414710.3390/cryst14010047Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing CatalystMiyuki Harada0Takuya Matsumoto1Department of Chemistry and Materials Engineering, Faculty of Chemistry, Materials and Bioengineering, Kansai University, Osaka 564-8680, JapanDepartment of Chemistry and Materials Engineering, Faculty of Chemistry, Materials and Bioengineering, Kansai University, Osaka 564-8680, JapanImprovements in the performance of electronic devices necessitate the development of polymer materials with heat dissipation properties. Liquid crystalline (LC) epoxies have attracted attention because of the orientation of their polymer network chains and their resultant high thermal conductivity. In this study, a diglycidyl ether of 1-methyl-3-(4-phenylcyclohex-1-enyl)benzene was successfully synthesized as an LC epoxy and the LC temperature range was evaluated via differential scanning calorimeter (DSC). The synthesized LC epoxy was cured with <i>m</i>-phenylenediamine (<i>m</i>-PDA) as an amine-type curing agent and 1-(2-cyanoethyl)-2-undecylimidazole (CEUI) as a latent curing catalyst, respectively. The LC phase structure and domain size of the resultant epoxy thermosets were analyzed through X-ray diffraction (XRD) and polarized optical microscopy (POM). High thermal conductivity was observed in the <i>m</i>-PDA system (0.31 W/(m·K)) compared to the CEUI system (0.27 W/(m·K)). On the other hand, in composites loaded with 55 vol% Al<sub>2</sub>O<sub>3</sub> particles as a thermal conductive filler, the CEUI composites showed a higher thermal conductivity value of 2.47 W/(m·K) than the <i>m</i>-PDA composites (1.70 W/(m·K)). This difference was attributed to the LC orientation of the epoxy matrix, induced by the hydroxyl groups on the alumina surface and the latent curing reaction.https://www.mdpi.com/2073-4352/14/1/47epoxythermosetscrosslinkingmechanical propertiesthermal propertyliquid crystals |
| spellingShingle | Miyuki Harada Takuya Matsumoto Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst Crystals epoxy thermosets crosslinking mechanical properties thermal property liquid crystals |
| title | Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst |
| title_full | Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst |
| title_fullStr | Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst |
| title_full_unstemmed | Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst |
| title_short | Thermal Conductivity and Orientation Structure of Liquid Crystalline Epoxy Thermosets Prepared by Latent Curing Catalyst |
| title_sort | thermal conductivity and orientation structure of liquid crystalline epoxy thermosets prepared by latent curing catalyst |
| topic | epoxy thermosets crosslinking mechanical properties thermal property liquid crystals |
| url | https://www.mdpi.com/2073-4352/14/1/47 |
| work_keys_str_mv | AT miyukiharada thermalconductivityandorientationstructureofliquidcrystallineepoxythermosetspreparedbylatentcuringcatalyst AT takuyamatsumoto thermalconductivityandorientationstructureofliquidcrystallineepoxythermosetspreparedbylatentcuringcatalyst |