Test Structure Design for Defect Detection during Active Thermal Cycling

Test Structure Design for Defect Detection during Active Thermal Cycling

Integrated power ICs acting as smart power switches for automotive or industrial applications are often subjected to active thermal cycling. Consequently, they undergo significant self-heating and are prone to various failure mechanisms related to the electro-thermo-mechanical phenomena that take pl...

Полное описание

Библиографические подробности
Главные авторы: Ciprian Florea, Dan Simon, Adrian Bojiță, Marius Purcar, Cristian Boianceanu, Vasile Țopa
Формат: Статья
Язык:English
Опубликовано: MDPI AG 2022-09-01
Серии:Sensors
Предметы:
active thermal cycling
DMOS power transistor
smart power IC
failure mechanisms
integrated sensors
metallization fatigue
Online-ссылка:https://www.mdpi.com/1424-8220/22/19/7223

Internet

https://www.mdpi.com/1424-8220/22/19/7223

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