Atomic layer deposition and other thin film deposition techniques: from principles to film properties

Thin film is a modern technology aimed at improving the structural, electrical, magnetic, optical, and mechanical properties of bulk materials. This technology has so far found applications in integrated circuits, semiconductor devices, transistors, light-emitting diodes, light crystal displays and...

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Main Authors: James A. Oke, Tien-Chien Jen
Format: Article
Language:English
Published: Elsevier 2022-11-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785422016039
_version_ 1811196725365309440
author James A. Oke
Tien-Chien Jen
author_facet James A. Oke
Tien-Chien Jen
author_sort James A. Oke
collection DOAJ
description Thin film is a modern technology aimed at improving the structural, electrical, magnetic, optical, and mechanical properties of bulk materials. This technology has so far found applications in integrated circuits, semiconductor devices, transistors, light-emitting diodes, light crystal displays and photoconductors, rectifiers, solar cells, sensors, and micro-electromechanical systems (MEMS). Methods of thin film deposition such as physical and chemical vapor deposition (PVD and CVD), sputtering, spin and dip coatings, and spray pyrolysis have been utilized for several years. But in recent times, the atomic layer deposition (ALD) technique has attracted the attention of researchers. In this current review, we have explored the most used techniques in the depositions of thin film materials with a focus on the properties of film produced, and the advantages and disadvantages of each technique. Generally, it was observed that the quality of films produced by these techniques depends greatly on the choice of substrate, deposition temperature, temperature window, and precursor used. It concluded by identifying ALD as an optimum technique in depositing ultra-thin film materials due to its simplicity, reproducibility, control over film composition and thickness, and high conformal deposited films at the atomic level. This study has established the opportunity for upcoming researchers to have an insight of selecting the most suitable technique for their study in various fields of research. Finally, the challenges and future perspectives of deposition techniques were highlighted.
first_indexed 2024-04-12T01:04:54Z
format Article
id doaj.art-beddace5337142d2867f333ba04b5b2b
institution Directory Open Access Journal
issn 2238-7854
language English
last_indexed 2024-04-12T01:04:54Z
publishDate 2022-11-01
publisher Elsevier
record_format Article
series Journal of Materials Research and Technology
spelling doaj.art-beddace5337142d2867f333ba04b5b2b2022-12-22T03:54:20ZengElsevierJournal of Materials Research and Technology2238-78542022-11-012124812514Atomic layer deposition and other thin film deposition techniques: from principles to film propertiesJames A. Oke0Tien-Chien Jen1Corresponding author.; Department of Mechanical Engineering Science, Faculty of Engineering and the Built Environment, University of Johannesburg, Auckland, 2006, Johannesburg, South AfricaCorresponding author.; Department of Mechanical Engineering Science, Faculty of Engineering and the Built Environment, University of Johannesburg, Auckland, 2006, Johannesburg, South AfricaThin film is a modern technology aimed at improving the structural, electrical, magnetic, optical, and mechanical properties of bulk materials. This technology has so far found applications in integrated circuits, semiconductor devices, transistors, light-emitting diodes, light crystal displays and photoconductors, rectifiers, solar cells, sensors, and micro-electromechanical systems (MEMS). Methods of thin film deposition such as physical and chemical vapor deposition (PVD and CVD), sputtering, spin and dip coatings, and spray pyrolysis have been utilized for several years. But in recent times, the atomic layer deposition (ALD) technique has attracted the attention of researchers. In this current review, we have explored the most used techniques in the depositions of thin film materials with a focus on the properties of film produced, and the advantages and disadvantages of each technique. Generally, it was observed that the quality of films produced by these techniques depends greatly on the choice of substrate, deposition temperature, temperature window, and precursor used. It concluded by identifying ALD as an optimum technique in depositing ultra-thin film materials due to its simplicity, reproducibility, control over film composition and thickness, and high conformal deposited films at the atomic level. This study has established the opportunity for upcoming researchers to have an insight of selecting the most suitable technique for their study in various fields of research. Finally, the challenges and future perspectives of deposition techniques were highlighted.http://www.sciencedirect.com/science/article/pii/S2238785422016039ALDThin filmDeposition techniquesFilm properties
spellingShingle James A. Oke
Tien-Chien Jen
Atomic layer deposition and other thin film deposition techniques: from principles to film properties
Journal of Materials Research and Technology
ALD
Thin film
Deposition techniques
Film properties
title Atomic layer deposition and other thin film deposition techniques: from principles to film properties
title_full Atomic layer deposition and other thin film deposition techniques: from principles to film properties
title_fullStr Atomic layer deposition and other thin film deposition techniques: from principles to film properties
title_full_unstemmed Atomic layer deposition and other thin film deposition techniques: from principles to film properties
title_short Atomic layer deposition and other thin film deposition techniques: from principles to film properties
title_sort atomic layer deposition and other thin film deposition techniques from principles to film properties
topic ALD
Thin film
Deposition techniques
Film properties
url http://www.sciencedirect.com/science/article/pii/S2238785422016039
work_keys_str_mv AT jamesaoke atomiclayerdepositionandotherthinfilmdepositiontechniquesfromprinciplestofilmproperties
AT tienchienjen atomiclayerdepositionandotherthinfilmdepositiontechniquesfromprinciplestofilmproperties