Atomic layer deposition and other thin film deposition techniques: from principles to film properties
Thin film is a modern technology aimed at improving the structural, electrical, magnetic, optical, and mechanical properties of bulk materials. This technology has so far found applications in integrated circuits, semiconductor devices, transistors, light-emitting diodes, light crystal displays and...
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Format: | Article |
Language: | English |
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Elsevier
2022-11-01
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Series: | Journal of Materials Research and Technology |
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Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422016039 |
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author | James A. Oke Tien-Chien Jen |
author_facet | James A. Oke Tien-Chien Jen |
author_sort | James A. Oke |
collection | DOAJ |
description | Thin film is a modern technology aimed at improving the structural, electrical, magnetic, optical, and mechanical properties of bulk materials. This technology has so far found applications in integrated circuits, semiconductor devices, transistors, light-emitting diodes, light crystal displays and photoconductors, rectifiers, solar cells, sensors, and micro-electromechanical systems (MEMS). Methods of thin film deposition such as physical and chemical vapor deposition (PVD and CVD), sputtering, spin and dip coatings, and spray pyrolysis have been utilized for several years. But in recent times, the atomic layer deposition (ALD) technique has attracted the attention of researchers. In this current review, we have explored the most used techniques in the depositions of thin film materials with a focus on the properties of film produced, and the advantages and disadvantages of each technique. Generally, it was observed that the quality of films produced by these techniques depends greatly on the choice of substrate, deposition temperature, temperature window, and precursor used. It concluded by identifying ALD as an optimum technique in depositing ultra-thin film materials due to its simplicity, reproducibility, control over film composition and thickness, and high conformal deposited films at the atomic level. This study has established the opportunity for upcoming researchers to have an insight of selecting the most suitable technique for their study in various fields of research. Finally, the challenges and future perspectives of deposition techniques were highlighted. |
first_indexed | 2024-04-12T01:04:54Z |
format | Article |
id | doaj.art-beddace5337142d2867f333ba04b5b2b |
institution | Directory Open Access Journal |
issn | 2238-7854 |
language | English |
last_indexed | 2024-04-12T01:04:54Z |
publishDate | 2022-11-01 |
publisher | Elsevier |
record_format | Article |
series | Journal of Materials Research and Technology |
spelling | doaj.art-beddace5337142d2867f333ba04b5b2b2022-12-22T03:54:20ZengElsevierJournal of Materials Research and Technology2238-78542022-11-012124812514Atomic layer deposition and other thin film deposition techniques: from principles to film propertiesJames A. Oke0Tien-Chien Jen1Corresponding author.; Department of Mechanical Engineering Science, Faculty of Engineering and the Built Environment, University of Johannesburg, Auckland, 2006, Johannesburg, South AfricaCorresponding author.; Department of Mechanical Engineering Science, Faculty of Engineering and the Built Environment, University of Johannesburg, Auckland, 2006, Johannesburg, South AfricaThin film is a modern technology aimed at improving the structural, electrical, magnetic, optical, and mechanical properties of bulk materials. This technology has so far found applications in integrated circuits, semiconductor devices, transistors, light-emitting diodes, light crystal displays and photoconductors, rectifiers, solar cells, sensors, and micro-electromechanical systems (MEMS). Methods of thin film deposition such as physical and chemical vapor deposition (PVD and CVD), sputtering, spin and dip coatings, and spray pyrolysis have been utilized for several years. But in recent times, the atomic layer deposition (ALD) technique has attracted the attention of researchers. In this current review, we have explored the most used techniques in the depositions of thin film materials with a focus on the properties of film produced, and the advantages and disadvantages of each technique. Generally, it was observed that the quality of films produced by these techniques depends greatly on the choice of substrate, deposition temperature, temperature window, and precursor used. It concluded by identifying ALD as an optimum technique in depositing ultra-thin film materials due to its simplicity, reproducibility, control over film composition and thickness, and high conformal deposited films at the atomic level. This study has established the opportunity for upcoming researchers to have an insight of selecting the most suitable technique for their study in various fields of research. Finally, the challenges and future perspectives of deposition techniques were highlighted.http://www.sciencedirect.com/science/article/pii/S2238785422016039ALDThin filmDeposition techniquesFilm properties |
spellingShingle | James A. Oke Tien-Chien Jen Atomic layer deposition and other thin film deposition techniques: from principles to film properties Journal of Materials Research and Technology ALD Thin film Deposition techniques Film properties |
title | Atomic layer deposition and other thin film deposition techniques: from principles to film properties |
title_full | Atomic layer deposition and other thin film deposition techniques: from principles to film properties |
title_fullStr | Atomic layer deposition and other thin film deposition techniques: from principles to film properties |
title_full_unstemmed | Atomic layer deposition and other thin film deposition techniques: from principles to film properties |
title_short | Atomic layer deposition and other thin film deposition techniques: from principles to film properties |
title_sort | atomic layer deposition and other thin film deposition techniques from principles to film properties |
topic | ALD Thin film Deposition techniques Film properties |
url | http://www.sciencedirect.com/science/article/pii/S2238785422016039 |
work_keys_str_mv | AT jamesaoke atomiclayerdepositionandotherthinfilmdepositiontechniquesfromprinciplestofilmproperties AT tienchienjen atomiclayerdepositionandotherthinfilmdepositiontechniquesfromprinciplestofilmproperties |