Development of Sn-9Zn Solder Alloy by Adding Bismuth
Tin-Zinc based on solder is a probable changing of lead element solder as a result of its enhanced mechanical characteristics. This alloy needs to be studied and explored to get a usable solder alloy having better properties. In this work Our objective of the accompanying investigation for alterati...
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| Format: | Article |
| Language: | English |
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University of Diyala
2020-12-01
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| Series: | Diyala Journal of Engineering Sciences |
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| Online Access: | https://djes.info/index.php/djes/article/view/752 |
| _version_ | 1811282528024133632 |
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| author | Abbas AL-ALbawee |
| author_facet | Abbas AL-ALbawee |
| author_sort | Abbas AL-ALbawee |
| collection | DOAJ |
| description |
Tin-Zinc based on solder is a probable changing of lead element solder as a result of its enhanced mechanical characteristics. This alloy needs to be studied and explored to get a usable solder alloy having better properties. In this work Our objective of the accompanying investigation for alteration the warm, physical and bind qualities of eutectic tin-9Zinc fastening alloy by expansion various ratios of bismuth content to give elective without lead solder alloy to utilize this compound for efferent electronic ventures. We found that the addition of bismuth element content improved the thermal, physical and electrical features and qualities. We got the mentioned results by using x-ray diffractometer, differential scanning calorimetry and LCR instrument to calculate electric resistivity and the contact edge (CA) is the most important factor used for assessing the solid surfaces wettability. Sn91Zn3Bi6 alloy has best solder properties as low melting temperature, pasty range and contact angle. And has the beast soldering properties for electronic application compared to commercial Pb- Sn alloy
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| first_indexed | 2024-04-13T01:54:21Z |
| format | Article |
| id | doaj.art-bee1878269b04c1587a29601a94c0fd9 |
| institution | Directory Open Access Journal |
| issn | 1999-8716 2616-6909 |
| language | English |
| last_indexed | 2024-04-13T01:54:21Z |
| publishDate | 2020-12-01 |
| publisher | University of Diyala |
| record_format | Article |
| series | Diyala Journal of Engineering Sciences |
| spelling | doaj.art-bee1878269b04c1587a29601a94c0fd92022-12-22T03:07:48ZengUniversity of DiyalaDiyala Journal of Engineering Sciences1999-87162616-69092020-12-0113410.24237/djes.2020.13405Development of Sn-9Zn Solder Alloy by Adding BismuthAbbas AL-ALbawee0Department of Material Engineering, College of Engineering, University of Diyala Tin-Zinc based on solder is a probable changing of lead element solder as a result of its enhanced mechanical characteristics. This alloy needs to be studied and explored to get a usable solder alloy having better properties. In this work Our objective of the accompanying investigation for alteration the warm, physical and bind qualities of eutectic tin-9Zinc fastening alloy by expansion various ratios of bismuth content to give elective without lead solder alloy to utilize this compound for efferent electronic ventures. We found that the addition of bismuth element content improved the thermal, physical and electrical features and qualities. We got the mentioned results by using x-ray diffractometer, differential scanning calorimetry and LCR instrument to calculate electric resistivity and the contact edge (CA) is the most important factor used for assessing the solid surfaces wettability. Sn91Zn3Bi6 alloy has best solder properties as low melting temperature, pasty range and contact angle. And has the beast soldering properties for electronic application compared to commercial Pb- Sn alloy https://djes.info/index.php/djes/article/view/752melting pointlead-free solderelectrical resistivitywettabilityspecific heatheat of fusion |
| spellingShingle | Abbas AL-ALbawee Development of Sn-9Zn Solder Alloy by Adding Bismuth Diyala Journal of Engineering Sciences melting point lead-free solder electrical resistivity wettability specific heat heat of fusion |
| title | Development of Sn-9Zn Solder Alloy by Adding Bismuth |
| title_full | Development of Sn-9Zn Solder Alloy by Adding Bismuth |
| title_fullStr | Development of Sn-9Zn Solder Alloy by Adding Bismuth |
| title_full_unstemmed | Development of Sn-9Zn Solder Alloy by Adding Bismuth |
| title_short | Development of Sn-9Zn Solder Alloy by Adding Bismuth |
| title_sort | development of sn 9zn solder alloy by adding bismuth |
| topic | melting point lead-free solder electrical resistivity wettability specific heat heat of fusion |
| url | https://djes.info/index.php/djes/article/view/752 |
| work_keys_str_mv | AT abbasalalbawee developmentofsn9znsolderalloybyaddingbismuth |